Low power electrically alterable nonvolatile memory cells and arrays

ABSTRACT

A method of providing a memory cell includes providing a body of a semiconductor material having a first conductivity type, arranging a filter of a conductor-filter system in contact with a first conductor of the conductor-filter system, arranging at least portion of a second conductor of a conductor-insulator system in contact with the filter, arranging a first insulator of the conductor-insulator system in contact with the second conductor at an interface, arranging a first region spaced from the second conductor, arranging a channel of the body between the first region and the second conductor, arranging a second insulator adjacent to the first region, arranging a charge storage region between the first and the second insulators, arranging a first portion of a word-line adjacent to and insulated from the charge storage region, and arranging a second portion of the word-line adjacent to and insulated from the body.

RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.11/234,646, filed Sep. 23, 2005, which application is aContinuation-In-Part of U.S. patent application Ser. No. 11/169,399filed on Jun. 28, 2005, entitled “METHOD AND APPARATUS TRANSPORTINGCHARGES IN SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE”. Thedisclosures of the above applications are incorporated herein byreference.

TECHNICAL FIELD

The present invention deals with nonvolatile memory, and relates morespecifically to Electrically Programmable Read Only Memories (EPROM) andElectrically Erasable and Programmable Read Only Memories (EEPROM). Moreparticularly, the present invention relates to memory cell and arrayarchitectures and methods forming cells and arrays of nonvolatile memorydevices.

BACKGROUND OF THE INVENTION

Nonvolatile semiconductor memory cells permitting charge storagecapability are well known in the art. The charges are typically storedin a floating gate to define the states of a memory cell. Typically, thestates can be either two levels or more than two levels (for multi-levelstates storage). Mechanisms such as channel hot electron injection(CHEI), source-side injection (SSI), Fowler-Nordheim tunneling (FN), andBand-to-Band Tunneling (BTBT) induced hot-electron-injection can be usedto alter the states of such cells in program and/or erase operations.Examples on employing such mechanisms for memory operations can be seenin cell structures in U.S. Pat. Nos. 4,698,787, 5,029,130, 5,792,670,5,146,426, 5,432,739 and 5,966,329.

All the above mechanisms and cell structures, however, have poorinjection efficiency (defined as the ratio of number of carrierscollected by the floating gate to the number of carriers supplied).Further, these mechanisms and cell structures require high voltages tosupport the memory operation, and voltage as high as 10V is often seen.It is believed that the high voltage demands stringent control on thequality of the insulator surrounding the floating gate. The memoriesoperated under these mechanisms thus are vulnerable to manufacturing andreliability problems.

In light of the foregoing problems, it is an object of the presentinvention to provide improved cell structures that can be operated toenhance carrier injection efficiency and to reduce operation voltages.It is another object of the present invention to provide charge carriers(electrons or holes) transporting with tight energy distribution andhigh injection efficiency. Other objects of the inventions and furtherunderstanding on the objects will be realized by referencing to thespecifications and drawings.

SUMMARY OF THE INVENTION

It is the object of the present invention to provide memory cellarchitectures and methods forming cells and arrays of nonvolatile memorycells.

Briefly, one embodiment of the present invention is a memory cell. Thememory cell comprises a body of a semiconductor material having a firstconductivity type, a conductor-filter system including a first conductorhaving thermal charge carriers and a filter contacting the conductor andincluding dielectrics for providing a filtering function on the chargecarriers of one polarity. The filter includes a first set ofelectrically alterable potential barriers for controlling flow of thecharge carriers of one polarity through the filter in one direction. Thememory cells further comprises a conductor-insulator system including asecond conductor having at least a portion thereof contacting the filterand having energized charge carriers from the filter, and a firstinsulator contacting the second conductor at an interface and havingelectrically alterable Image-Force potential barriers adjacent to theinterface. Moreover, the memory cells further comprises a first regionspaced-apart from the second conductor with a channel of the bodydefined there between, a second insulator adjacent to the first region,a charge storage region disposed in between the first and the secondinsulators, and a word-line of a conductor having a first portiondisposed over and insulated from the charge storage region and a secondportion comprising the first conductor disposed over and insulated fromthe body.

Briefly, another embodiment of the present invention is a memory cell.The memory cell comprises a body of a semiconductor material having afirst conductivity type, a conductor-filter system including a firstconductor having thermal charge carriers and a filter contacting theconductor and including dielectrics for providing a filtering functionon the charge carriers of one polarity. The filter includes a first setof electrically alterable potential barriers for controlling flow of thecharge carriers of one polarity through the filter in one direction, anda second set of electrically alterable potential barriers forcontrolling flow of charge carriers of an opposite polarity through thefilter in another direction that is substantially opposite to the onedirection. The memory cells further comprises a conductor-insulatorsystem including a second conductor having at least a portion thereofcontacting the filter and having energized charge carriers from thefilter, and a first insulator contacting the second conductor at aninterface and having electrically alterable Image-Force potentialbarriers adjacent to the interface. Moreover, the memory cells furthercomprises a first region spaced-apart from the second conductor with achannel of the body defined there between, a second insulator adjacentto the first region, a charge storage region disposed in between thefirst and the second insulators, and a word-line of a conductor having afirst portion disposed over and insulated from the charge storage regionand a second portion comprising the first conductor disposed over andinsulated from the body. Additionally, the memory cell further comprisesmeans transporting the energized charge carriers over the Image-Forcepotential barrier onto the charge storage region.

Briefly, an additional embodiment of the present invention is anonvolatile memory array. The nonvolatile memory array comprises asubstrate, and a plurality of nonvolatile memory cells on the substrateand arranged in a rectangular array of rows and columns. Each of theplurality of nonvolatile memory cells comprises a body of asemiconductor material having a first conductivity type, aconductor-filter system including a first conductor having thermalcharge carriers and a filter contacting the conductor and includingdielectrics for providing a filtering function on the charge carriers ofone polarity. The filter includes a first set of electrically alterablepotential barriers for controlling flow of the charge carriers of onepolarity through the filter in one direction, and a second set ofelectrically alterable potential barriers for controlling flow of chargecarriers of an opposite polarity through the filter in another directionthat is substantially opposite to the one direction. Each of the memorycells further comprises a conductor-insulator system including a secondconductor having at least a portion thereof contacting the filter andhaving energized charge carriers from the filter, and a first insulatorcontacting the second conductor at an interface and having electricallyalterable Image-Force potential barriers adjacent to the interface.Moreover, each of the memory cells further comprises a first regionspaced-apart from the second conductor with a channel of the bodydefined there between, a second insulator adjacent to the first region,a charge storage region disposed in between the first and the secondinsulators; and a third conductor having a first portion disposed overand insulated from the charge storage region and a second portioncomprising the first conductor disposed over and insulated from thebody.

The foregoing and other objects, features and advantages of the presentinvention will be apparent from the following detailed description inconjunction with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is herein described, by ways of example only, withreference to the accompanying drawings, wherein

FIG. 1A is an energy band diagram showing hot electrons having narrowenergy spectrum transporting through potential barrier in theenergy-band of a conductor-insulator system in accordance with thepresent invention;

FIG. 1B shows barrier height and location of the barrier peak of theImage-Force potential barrier as a function of the dielectric fieldapplied to the insulator;

FIG. 2 is an energy band diagram showing hot holes having narrow energyspectrum transporting through potential barrier in the valence band ofthe conductor-insulator system;

FIG. 3 is an energy band diagram for a conductor-filter system inaccordance with the present invention;

FIG. 4 shows relative energy level of threshold energy to Fermi-levelwith the applied voltage Va as the plotting parameter;

FIG. 5 is an energy band diagram in accordance with one embodiment oncharge-injection system of the present invention illustrating thefiltering and the image-force barrier lowering forballistic-electrons-injection mechanism;

FIG. 6 is an energy band diagram in accordance with another embodimentof the present invention illustrating the charge-filtering and theimage-force barrier lowering for ballistic-light-holes-injectionmechanism;

FIG. 7 shows normalized tunneling probability plotted as a function ofreciprocal of voltage across TD for LH and HH;

FIG. 8 is the cross sectional view of a cell structure in accordancewith one embodiment of the present invention;

FIG. 9 is the cross sectional view of a cell structure in accordancewith another embodiment of the present invention;

FIG. 10 is the schematics showing array architecture constructed ofmemory cells in accordance with the present invention.

FIG. 11 is a top view of a semiconductor substrate used in the firststep of the method of manufacturing memory cells in present invention;

FIG. 11A is a cross sectional view of the structure taken along the lineAA′ in FIG. 1;

FIG. 12 is a top view of the structure showing the next step of FIG. 11Ain the formation of a memory array and cells in accordance with thepresent invention;

FIGS. 12A-19 are cross sectional views taken along the line A-A′ in FIG.12 illustrating in sequence the next steps in processing to form thememory cells and array in accordance with the present invention;

FIGS. 20 and 21 are top views of the structures showing in sequence thenext step(s) in the formation of a memory array and cells in accordancewith the present invention;

FIGS. 20A and 21A are cross sectional views taken along the line A-A′ inFIGS. 20 and 21, respectively, illustrating in sequence the next stepsin processing to form the memory cells and array in accordance with thepresent invention;

FIGS. 20B and 21B are cross sectional views taken along the line B-B′ inFIGS. 20 and 21, respectively, illustrating in sequence the next stepsin processing to form the memory cells and array in accordance with thepresent invention;

FIGS. 20C and 21C are cross sectional views taken along the line C-C′ inFIGS. 20 and 21, respectively, illustrating in sequence the next stepsin processing to form the memory cells and array in accordance with thepresent invention;

FIGS. 20D and 21D are cross sectional views taken along the line D-D′ inFIGS. 20 and 21, respectively, illustrating in sequence the next stepsin processing to form the memory cells and array in accordance with thepresent invention;

FIGS. 20E and 21E are cross sectional views taken along the line E-E′ inFIGS. 20 and 21, respectively, illustrating in sequence the next stepsin processing to form the memory cells and array in accordance with thepresent invention;

DETAILED DESCRIPTION OF THE INVENTION

As used herein, the term conductor represents conductive materials suchas metal conductor and semiconductor. The symbol n+ indicates a heavilydoped n-type semiconductor material typically having a doping level ofn-type impurities (e.g. arsenic) on the order of 10²⁰ atoms/cm³. Thesymbol p+ indicates a heavily doped p-type semiconductor materialtypically having a doping level of p-type impurities (e.g. boron) on theorder of 10²⁰ atoms/cm³. Where appropriate, the same referenceindicators will be used throughout the drawings and the followingdetailed description to refer to the same or similar parts.

The memory cells of the present invention are constructed based on aconductor-insulator system and a conductor-filter system.

FIG. 1A presents the energy band diagram for a conductor-insulatorsystem of the present invention showing energized charge carrierstransporting over an Image-Force potential barrier 24 of theconductor-insulator system. The conductor-insulator system comprises aconductor 10 having energized charge carriers 37 with an energydistribution 38 and an insulator 12 contacting the conductor 10 at aninterface 14 and having an Image-Force potential barrier 24 adjacent tothe interface 14, wherein the Image-Force potential barrier 24 iselectrically alterable to permit the energized charge carriers 37transporting there over.

In FIG. 1A, the diagram shows the conductor 10 has a Fermi-level energy16 in its energy-band. The energy-band of the insulator 12 is shown onconduction band 18 and the conductor-insulator system is shown having anImage-Force effect that alters the shape of a potential barrier from atriangle barrier 24′ having a sharp corner at barrier edge to a trianglebarrier 24 having a smooth corner (i.e. the “Image-Force potentialbarrier” or “Image-Force barrier”). The Image-Force effect is alsotermed Image-Force barrier lowering effect and the effect lowers thepotential barrier from a barrier height φ_(bo) 22 to a barrier heightφ_(b) 20 by a barrier offset Δφ_(b) 26. A barrier peak 28 is shown atthe peak of the Image-Force barrier 24 having a location at a distanceX_(m) 30 away from an interface 14 between conductor 10 and insulator12. A conduction band 18′ is shown for cases without the Image-Forceeffect as a contrast.

In FIG. 1A, the energized charge carriers (hot electrons 37) are shownhaving energy distribution 38 on population distributed in a narrowenergy spectrum Δ38 when transporting over Image-Force barrier 24 ofconductor-insulator system. Further, the hot electrons 37 are shownhaving peak population at an energy level 33 with respect to theFermi-level 16. Having such energy level 33, all of these electrons 37are shown able to surmount the Image-Force barrier 24 to becomeelectrons 37′ having a distribution 38′ on population similar to 38. Inaccordance with one embodiment of the present invention, typically, theenergy distribution 38 of the energized charge carriers 37 has theenergy spectrum Δ38 in the range of about 30 meV to about 300 meV.

The conductor-insulator system is characterized by the energized chargecarriers 37 and the Image-Force effect on altering the barrier height 20and the distance 30 of the barrier peak 28.

FIG. 1B shows the effect of Image-Force on altering barrier height andlocation of the barrier peak of the Image-Force potential barrier. Thebarrier height 20 and location 30 of barrier peak are plotted as afunction of electric field ε_(D) applied to the insulator. Inillustrating the effect, oxide is assumed as the material for theinsulator. FIG. 1B shows that the barrier height 20 can be lowered from3.1 eV to about 2.5 eV when an electric field ε_(D) of about 5 MV/cm isapplied to the insulator. This effect illustrates the Image-Forcebarrier lowering effect. Further, it illustrates the nature of theImage-Force potential barrier that the Image-Force potential barrier 24is electrically alterable through electric field. Additionally, itillustrates a means on altering barrier height of the barrier 24 byusing an electric field. Typically, such electric field is applied byapplying a voltage across the insulator. For example, for an oxideinsulator having 6 nm in thickness, a voltage of about 3.0V across theoxide is required to generate 5 MV/cm. This Image-Force effect providesthe saving on electron kinetic energy made possible by the appliedelectric field because the Image-Force and the potential barrier must becombated only to a distance X_(m) 30, and not to infinity. Oncetransporting beyond the distance X_(m) 30, the energized charge carriers37 are permitted to transport over the Image-Force barrier 24.

FIG. 1B further shows the peak barrier distance X_(m) 30 to theconductor/insulator interface can be shortened from a range of infinity(at ε_(D)=0 MV/cm) to a range less than 1 nm (at ε_(D)=2 MV/cm). It isknown in solid-state physics that the polarization of a medium (e.g. theinsulator of FIG. 1A) cannot follow a moving charge when the transittime of the charge is shorter than the dielectric polarization time ofthe medium. Shortening peak barrier distance X_(m), as provided in FIG.1B, can shorten the charge transit time, and such effect is desirable asit can provide a means on lowering the dielectric constant of theImage-Force barrier 24 (“Image-Force dielectric constant”) and hence ameans on enhancing the barrier lowering effect. Other means, such asincreasing charge moving velocity (e.g. by increasing its kineticenergy), can also be considered to reduce transit time, and hencereducing the Image-Force dielectric constant. This is considered asanother means on altering barrier height of the Image-Force potentialbarrier. Typically, with such means, the dielectric constant can belowered from its static value (e.g. about 3.9 for oxide) to a value nearthe optical one (e.g. about 2.2 for oxide), and results in anenhancement on lowering the Image-Force barrier 24 by about 0.14 eV (foroxide). It is noted that this effect is a result of a short transit timefor carriers (electrons) 37 traversing the distance X_(m) 30, andhappens in the absence of interaction with other particles when thecarrier transit time is shorter than the dielectric polarization time ofthe insulator. It is noted that in some situations, it is possible thecarriers can interact with quantum mechanical particles (e.g. phonons)within the distance 30. Such interaction can result in the Image-Forcedielectric constant of the barrier 24 be slightly larger than itsoptical one, and hence can slightly weaken the effect on barrierlowering as employing means provided herein.

The unique portion of the conductor-insulator system is that electrons37 are packed in a tight energy distribution and the Image-Force barrier24 functions as a “Full-Pass Filter” permitting all the hot electronstraversing there through at a lower kinetic energy. It thus bringsadvantages on higher injection efficiency and lower operation voltage tothe system.

Although the forgoing illustrations are made for electrons as theenergized charge carriers and conduction band as energy band of thebarrier, it is obvious that the same illustrations can be readily madefor other types of energized charge carriers, such as holes, and forother types of energy band, such as valence band.

FIG. 2 presents an energy band diagram for holes as an example forillustration. In FIG. 2, the conductor-insulator system comprises aconductor 10 having energized charge carriers 40 with an energydistribution 48 and an insulator 12 contacting the conductor 10 at aninterface 14 and having an Image-Force potential barrier 42 adjacent tothe interface 14, wherein the Image-Force potential barrier 42 iselectrically alterable to permit the energized charge carriers 40transporting there over.

The diagram of FIG. 2 is in all respects the same as that of FIG. 1Aexcept few differences. One of the differences is that instead ofproviding hot electrons 37 as the transporting charge carriers, thediagram is provided with energized holes 40 (or “hot holes” 40).Additionally, barriers formed by the insulator are now in connectionwith valence band of the insulator. Also shown are a barrier height 41′of a potential barrier 42′ in connection with a valence band 44′ forcase without the Image-Force effect, and a barrier height 41 of anImage-Force barrier 42 at valence band 44 of the conductor-insulatorsystem of FIG. 1A. The barrier height 41 is lowered by the Image-Forcebarrier lowering effect in similar way as described for barrier height20 in connection with FIGS. 1A and 1B while an electric field is appliedto insulator.

In FIG. 2, hot holes 40 are shown having an energy distribution 48 onpopulation distributed in a Gaussian-shape profile having a narrowenergy spectrum Δ48. The distribution 48 is shown having a peakdistribution 48 p and a tail distribution 48 t. The holes at the peakdistribution 48 p are shown having a kinetic energy 46 with respect tothe Fermi-level 16 of the conductor. The kinetic energy 46 is shownslightly higher than the Image-Force barrier height 41 and lower thanthe barrier height 41′. Without the Image-Force barrier lowering effect,holes 40 having the distribution 48 are shown having their energy belowbarrier height 41′ and thus are unable to surmount the barrier 42′.However, with the Image-Force effect, holes 40 are shown having amajority portion (except the tail portion 48 t) being able to surmountthe Image-Force barrier 42, transporting along the forward direction 34to become holes 40′ having an energy distribution 48′ on theirpopulation. Such holes 40′ have energy higher than the valence band 44and can continue transporting within the insulator along the samedirection to reach material adjacent to the other side of the insulator(not shown). The holes 40 within the tail distribution 48 t are shownhaving kinetic energy slightly below the barrier height 41. Such holesare blocked from surmounting Image-Force barrier 42 and are not includedin the distribution 48′. However, due to the tight energy spectrum Δ48of holes 40, situation on blocking holes 40 within the tail distribution48 t can be easily avoided by lifting energy of such holes throughapplying an additional small voltage (e.g. about 100 mV). The exampledescribed here illustrates an advantage on transporting energized chargecarriers having tight energy distribution in the conductor-insulatorsystem of the present invention.

It is now clear that with the Image-Force barrier lowering effectemployed in the conductor-insulator system of the present invention, hotcarriers (electrons or holes) can be transported through insulatorbarrier at lower kinetic energy, and the operation voltage can belowered when employing such effect for operating memory cell orsemiconductor devices. To achieve high injection efficiency, it isdesirable that carriers having tight energy spectrum on energydistribution are provided as the hot carriers and are used along withthe Image-Force barrier lowering effect for memory cell operations.

It is to be understood that the present invention is not limited to theillustrated herein and embodiments described above, but encompasses anyand all variations falling within the scope of the appended claims. Forexample, although the carriers distributions 38 and 48 of the presentinvention is illustrated in Gaussian shape, it should be apparent tothose having ordinary skill in the art that the distribution can beextended to any other type of shapes and spectrums, and the shape neednot be symmetrical in the energy.

The conductor of the conductor-insulator system can be a semiconductor,such as n+ polycrystalline Silicon (“polysilicon”), p+ polysilicon,heavily-doped polycrystalline Silicon-Germanium (“poly-SiGe”), or ametal, such as aluminum (Al), platinum (Pt), Au, Tungsten (W),Molybdenum (Mo), ruthenium (Ru), tantalum (Ta), nickel (Ni), tantalumnitride (TaN), titanium nitride (TiN) etc, or alloy thereof, such asplatinum-silicide, tungsten-silicide, nickel-silicide etc. The insulatorcan be a dielectric or air. When dielectric is considered as theinsulator, material such as oxide, nitride, oxynitride (“SiON”) can beused for the dielectric. Additionally, dielectrics having dielectricconstant (or permittivity) k lower or higher than that of oxide (“Low-kdielectrics” or “High-k dielectrics”, respectively) can also beconsidered as the material for the insulator. Such Low-k dielectrics canbe fluorinated silicon glass (“FSG”), SiLK, porous oxide, such asnano-porous carbon-doped oxide (“CDO”) etc. Such High-k dielectrics canbe aluminum oxide (“Al₂O₃”), hafnium oxide (“HfO₂”), titanium oxide(“TiO₂”), zirconium oxide (“ZrO₂”), tantalum pen-oxide (“Ta₂O₅”) etc.Furthermore, any composition of those materials and the alloys formedthereof, such as hafnium oxide-oxide alloy (“HfO₂—SiO₂”),hafnium-aluminum-oxide alloy (“HfAlO”), hafnium-oxynitride alloy(“HfSiON”) etc. can be used for the dielectrics. Moreover, insulatorneed not be of dielectric materials having a uniform chemical elementand need not comprising single layer, but rather can be dielectricmaterials having graded composition on its element, and can comprisemore than one layer.

FIG. 3 provides an energy band diagram for a conductor-filter system 59in accordance with another embodiment of the present invention. In theconductor-filter system 59 of FIG. 3, there are shown a filter 52contacting a conductor 50. The conductor 50 has thermal charge carriersof electrons 56. The filter 52 contacts the conductor 50 and includesdielectrics 53 and 54 for providing a filtering function on the chargecarriers 56 of one polarity (negative charge carriers, electrons 56),wherein the filter 52 includes electrically alterable potential barriers24 ₅₃ and 24 ₅₄ for controlling flow of the charge carriers 56 of onepolarity through the filter 52 in one direction (forward direction 34).

FIG. 3 is an example of the filtering function. The conductor 50 hasFermi-level energy 16 ₅₀ and can be a semiconductor, such as n+polysilicon, p+ polysilicon, heavily-doped polycrystallineSilicon-Germanium (“poly-SiGe”), or a metal, such as aluminum (Al),platinum (Pt), Au, Tungsten (W), Molybdenum (Mo), ruthenium (Ru),tantalum (Ta), nickel (Ni), tantalum nitride (TaN), titanium nitride(TiN) etc, or alloy thereof, such as platinum-silicide,tungsten-silicide, nickel-silicide etc. The filter 52 is showncomprising a tunneling dielectric TD 53 and a blocking dielectric BD 54.The tunneling dielectric TD 53 is shown having a barrier 24 ₅₃ formed inthe conduction band 18 ₅₃ of TD 53. The blocking dielectric BD 54 isshown having a barrier 24 ₅₄ formed in the conduction band 18 ₅₄ of BD54 and the conduction band 18 ₅₄ is shown having an offset 55 with theconduction band 18 ₅₃ of TD 53. TD 53 is disposed adjacent to theconductor 50, and BD 54 is disposed adjacent to TD 53. Typically, BD 54has an energy band gap narrower than that of TD 53. The filter 52 canhave different band bending on conduction bands as a voltage is appliedacross the filter. The conduction band 18 ₅₄ of BD 54 is shown having aless band bending than that shown for conduction band 18 ₅₃ of TD 53.The conductor 50 supplies thermal electrons 56 having an energydistribution 57 on population. The energy distribution 57 of electrons56 is shown below Fermi-level energy 16 ₅₀ and has a peak distribution57 p and a tail distribution 57 t in its distribution profile. Theconductor 50 provides charge carriers having energy at or lower thanFermi-level energy, and hence functions somewhat like a “low-pass”carrier provider. With electric fields applied in the filter 52,electrons 56 in the peak portion distribution 57 p are shown being ableto transport through TD 53 in quantum mechanical tunneling mechanism(e.g. direct tunneling) through the barrier 24 ₅₃ of TD 53, and canenter the conduction band 18 ₅₄ of BD 54 to become energized electrons56′ having a tight energy spectrum Δ57′ on energy distribution 57′. In acontrast, the electrons 56 within the tail distribution 57 t are shownunable to tunnel through barriers 24 ₅₃ and 24 ₅₄. The barrier 24 ₅₄ ofBD 54 provided in the filter 52 forms an additional tunneling barrierfor the electrons 56 within the tail distribution 57 t and a blockingeffect on these electrons takes place and is made by keeping barrier 24₅₄ at an energy level (“threshold energy” 58) higher than the energy ofthese electrons. The threshold energy 58 is to first order establishedby both barriers 24 ₅₃ and 24 ₅₄ (it's controlled by a voltage drop inbarrier 24 ₅₃ and the offset 55 between barriers 24 ₅₃ and 24 ₅₄). Theblocking effect of barrier structure of filter 52 thus provides afiltering mechanism producing a high-pass filtering effect on tunnelingcharge carriers 56. This filtering effect is unique and is somewhatdifferent than the filtering effect on energized carriers (e.g. hotelectrons 32) described in connection with FIG. 1A. While TD 53 and BD54 are shown in the filter 52 of FIG. 3, such showing is only by way ofexample and any additional layers having potential barriers suitable forcontrolling carrier flow can be employed. Such layers can be asemiconductor or a dielectric and can be disposed in between TD 53 andBD 54 or can be disposed adjacent to only one of them.

The unique portion of the conductor-filter system of FIG. 3 lies on itscapability of providing charge carriers transporting in tight energydistribution. Such capability is a result of the “low-pass” carrierprovider function of the conductor 50 and the high-pass filter functionof the filter 52. Combing both such functions, the conductor-filtersystem of FIG. 3 provides a “band-pass” filtering function that permitscharge carriers having narrow energy spectrum in their distribution betransported. The band-pass filtering function is one embodiment of thefiltering function of filter 52, and permits the conductor-filter systemfunctioning as a “band-pass filter” having a “bandwidth” controlled bythe Fermi-level energy 16 ₅₀ and the threshold energy 58. Typically, theenergy spectrum is in the range from about 30 meV to about 900 meV, andis preferably in the range from about 30 meV to about 300 meV.

The filter 52 provides filtering effect on passing electrons havingenergy higher than the threshold energy 58. This results in passingelectrons in the peak distribution 57 p and blocking electrons in thetail distribution 57 t. The energy distribution 57′ of electrons 56′ isshown as an example illustrating the “band-pass” filtering function ofthe conductor-filter system of FIG. 3, and the distribution 57′ is shownsimilar to the peak distribution 57 p of the distribution 57 toillustrate this effect. For best “band-pass” filtering effect, theenergy spectrum Δ57′ of distribution 57′ typically can be narrowed orwiden by adjusting the threshold energy 58 at a higher or a lower level,respectively, than level shown in FIG. 3. Ability on adjusting energyspectrum Δ57′ is desirable as it permits a modulation on “bandwidth” ofthe band-pass filter for filtering effect in any practical application.This can be done by adjusting the voltage applied across filter 52 or byadjusting other parameters to be described in following paragraphs.

In constructing the filter 52 of FIG. 3, BD 54 having a largerdielectric constant relative to that of TD 53 is usually desirable forfollowing considerations. First, it reduces the electric field in BD 54,which can reduce the tunneling probability of electrons in the taildistribution 57 t, and hence can enhance the blocking effect on theseelectrons. Furthermore, when applying a voltage across the filter 52 forthe filtering effect, the larger dielectric constant for BD 54 permits alarger portion of the applied voltage appearing across TD 53. Thisenhances voltage conversion between applied voltage and voltage acrossTD, thus has advantages on lowering the applied voltage required for thefiltering effect, increasing sensitivity of the applied voltage on thefiltering effect, and increasing blocking range in energy spectrum forelectrons distributed in the tail distribution.

Additionally, other parameters can also be considered in constructingthe filter 52 of FIG. 3 for adjusting the energy spectrum Δ57′. One suchparameter is the conduction band offset 55 between BD and TD. Theconduction band offset 55 can be tailored at different values to controlthe threshold energy 58 beyond which electrons 56 in the distribution 57are permitted to tunnel through the filter 52. This can be done byproperly choosing materials for BD 54 and for TD 53. In a specificexample, when choosing oxide as the material for TD 53, a dielectricfilm of oxynitride system (“SiO_(x)N_(1-x)”) will be a good candidatefor BD 54 because of its well-proven manufacturing-worthy film qualityand process control. In SiO_(x)N_(1-x), the “x” is the fractional oxideor the equivalent percentage of oxide in the oxynitride film. Forexample, x=1 is for case where the film is a pure oxide; similarly x=0is for case where the film is a pure nitride. As the fractional oxide xis changed from 0 to 1, the conduction band offset 55 can be changedfrom about 1 eV to 0 eV. Thus, a tailoring on the fractional oxide x inSiO_(x)N_(1-x) permits a tailoring on the conduction band offset 55 to adesired range for filter 52, and hence provides method on adjusting theenergy spectrum Δ57′ (i.e. the “bandwidth” of the band-pass filter) torange desired for use in practical applications.

Other parameters such as thicknesses of TD 53 and BD 54 and Fermi-levelenergy 16 ₅₀ of conductor 50 can also be used to provide methodadjusting the threshold energy level 58, and its level relative to theFermi-level energy 16 ₅₀, and hence the “band-width” of the band-passfilter. These parameters are considered herein in constructing theconductor-filter system of FIG. 3. For illustration purpose,polysilicon, oxide, and nitride are assumed as the materials forconductor 50, TD 53, and BD 54, respectively, of the conductor-filtersystem of FIG. 3. The oxide of TD is assumed having a thickness of 3 nm.FIG. 4 shows the relative energy level of the threshold energy 58 to theFermi-level 16 ₅₀ for two cases illustrated here. The range wherethreshold energy to Fermi-level is in negative value corresponds tosituation where threshold energy is at level lower than the Fermi-level,and the difference between them to first order corresponds to the“band-width” of the band-pass filter. The two cases have differences onFermi-level of the polysilicon (n+ vs. p+ polysilicon) and on appliedvoltage Va across the filter 52. The applied voltage Va can determinethe kinetic energy of electrons 56′ after tunneling through the filter.Referring to FIG. 4, for the case with p+ polysilicon and Va=−4V, therange where threshold energy is under the Fermi-level ranges from 0 eVto about 0.4 eV as reducing a thickness of BD (“T_(BD)”) from about 3 nmto about 2 nm. For the case with n+ polysilicon and Va=−3V, a widerrange (about 0.8 eV) for threshold energy under the Fermi-level is shownfor T_(BD) within the range of 5 nm to 2 nm.

It should now be clear that the threshold energy relative to Fermi-levelof conductor can be adjusted by method adjusting thicknesses of TD andBD in the filter and/or by adjusting Fermi-level of conductor. Suchmethod can be used to tailor the band-width of the transporting chargeto a desired range for a practical application. The kinetic energy oftransporting charge carriers can be controlled and targeted to anapplication by employing this method.

The conductor-filter system of FIG. 3 can be used to provide band-passfilter function for other type of charge carriers, such as holes (e.g.light-holes (“LH”) or heavy holes (“HH”)). Similar considerations asdescribed in connection with FIGS. 3 and 4 for electrons can be readilyapplied to these holes by considering the tunneling barriers of filter52 formed in the valence band of energy band diagram. Due to theopposite charge polarity of holes to electrons, band-pass filteringholes can be done by reversing the voltage polarity across filter 52from the one shown in FIG. 3.

It should also be clear to those of ordinary skill in the art that theteachings of this disclosure can be applied to modify the dielectrics offilter through which the filtered charge distribution can be tailoredfor the filtering effect. For example, although the dielectric constantof BD 54 is illustrated to be greater than that of TD 53, it should beclear that the teaching of this disclosure can be applied to modify theBD 54 to material having dielectric constant similar to that of TD 53 toeffectively pass charge carriers in peak distribution during tunnelingtransport. Additionally, the quantum mechanisms in this disclosure neednot be direct tunneling, but rather can be any other types of mechanismsuch as Frenkel-Poole emission that effectively transports thermalcharge carriers from the conductor through the filter. Furthermore, TD53 and BD 54 need not be of materials having a uniform chemical elementbut can be materials having graded composition on its element. Inaddition, any appropriate dielectric, such as aluminum oxide (“Al₂O₃”),hafnium oxide (“HfO₂”), titanium oxide (“TiO₂”), zirconium oxide(“ZrO₂”), tantalum pen-oxide (“Ta₂O₅”) etc. can be used in place ofoxide, nitride, or oxynitride. Furthermore, any composition of thosematerials and the alloys formed thereof, such as hafnium oxide-oxidealloy (“HfO₂—SiO₂”), hafnium-aluminum-oxide alloy (“HfAlO”),hafnium-oxynitride alloy (“HfSiON”) etc. can be used in place of oxide,nitride, or oxynitride.

FIG. 5 provides an energy band diagram of a charge-injection system oninjecting electrons having tight energy distribution. Referring to FIG.5, there is shown a conductor-filter system 59 of the type described inconnection with FIG. 3, a conductor-insulator system 60 of the typedescribed in connection with FIG. 1A, a charge storage region (“CSR”)66, an insulator such as a channel dielectric (“CD”) 68, and asemiconductor region such as a body 70. The energy band structure ofFIG. 5 is shown with its full band structure. For example, in theconductor-filter system 59, there are also shown valence bands 44 ₅₃ and44 ₅₄ in addition to the conduction bands 18 ₅₃ and 18 ₅₄ of FIG. 3. Theconductor-filter system 59 comprises a tunneling-gate (“TG”) 61 and acharge filter 52 as the conductor and the filter of the system,respectively. The filter 52 includes potential barriers 24 ₅₃ and 24 ₅₄,and has a threshold energy 58 established by the barriers forcontrolling its filtering effect as described in connection with FIG. 3.The filter 52 further comprises the tunneling dielectric (“TD”) 53 andthe blocking dielectric (“BD”) 54 as described in connection with FIG.3. The conductor-insulator system 60 comprises a ballistic gate (“BG”)62 and a retention dielectric (“RD”) 64 as the conductor and theinsulator of the system, respectively. The energy band diagram of thecharge-injection system in regions from TG 61 to RD 64 is constructed by“contacting” the filter 52 of the conductor-filter system 59 to theconductor (BG 62) of the conductor-insulator system 60. TG 61 and BG 62are semiconductors having conduction band 18 ₆₁ and valence band 44 ₆₁,and conduction band 18 ₆₂ and valence band 44 ₆₂ for TG 61 and BG 62,respectively. TG 61 is shown of a p-type semiconductor having thermalelectrons 56 in the valence band 44 ₆₁ as the supplied carriers. CSR 66is shown insulated from BG 62 and body 70 by dielectrics RD 64 and CD68, respectively, and comprises semiconductor having a conduction band18 ₆₆ and a valence band 44 ₆₆ and of n-type conductivity. CSR 66 maycomprise semiconductor of other type of conductivity (e.g. p-type), andmay comprise metal or any other suitable material (e.g. nano-particlesor traps in dielectrics) that can effectively store charge carriers.Body 70 comprises semiconductor having conduction bands 18 ₇₀, andvalence band 44 ₇₀, respectively, and can be used to modulate anImage-Force barrier 24 ₆₄ of the conductor-Insulator system 60 bycoupling voltage into CSR 66 through adjacent dielectric such as CD 68.Dielectrics RD 64 and CD 68 are shown in single layer and can generallycomprise more than one layer to form a composite layer.

In the conductor-filter system 59 of FIG. 5, the conductor 61 hasthermal charge carriers 56. The filter 52 contacts the conductor 61 andincludes dielectrics 53 and 54 for providing a filtering function on thecharge carriers 56 of one polarity (negative charge carriers), whereinthe filter includes a first set of electrically alterable potentialbarriers 24 ₅₃ and 24 ₅₄ for controlling flow of the charge carriers 56of one polarity through the filter 52 in one direction (forwarddirection 34). In addition to controlling the one polarity of chargecarriers (negative charge carriers, electrons 56), the filter 52 furtherincludes a second set of electrically alterable potential barriers 42 ₅₃and 42 ₅₄ for controlling the flow of charge carriers of an oppositepolarity (positive charge carriers, LH 72 and HH 73) through the filterin another direction (backward direction 74) that is substantiallyopposite to the one direction.

Such filtering function permits charge carriers of one polarity typetransporting along the forward direction 34 (i.e. from TG 61 to BG 62)and blocks charge carriers of an opposite polarity type transportingalong a backward direction 74 (i.e. from BG 62 to TG 61). Thus, thefilter 52 provides a charge-filtering function that can “purify” thecharge flow. The charge-filtering function is another embodiment of thefiltering function of filter 52.

FIG. 5 further provides illustration on process forming and injectingcharges having tight energy distribution. There are shown thermalelectrons 56 having an energy distribution 57 on population be suppliedby TG 61 as supplied carriers. These electrons 56 are filtered by filter52 during their transport through the filter 52 via mechanisms such asdirect tunneling and Frenkel-Poole emission described in connection withFIG. 3. After filtered, thermal electrons become energized electrons 56′having energy higher than the conduction band 18 ₅₄ and having a tighterenergy distribution 57′ than the distribution 57 before filtered. Suchelectrons 56′ are fed to the conductor-insulator system 60. In one case,a portion of the electrons 56′ can transport through BG 62 withoutscattering (“ballistic transport”) at a kinetic energy 33 higher thanthe conduction band 18 ₆₂ of BG 62 to become energized electrons 37 atthe interface of BG 62 and RD 64. Such electrons 37 do not experiencescattering with other particles (e.g. electrons, phonons etc.), andhence can conserve their kinetic directional energy and momentum alongoriginal movement. In another case, electrons 56′ can transport throughBG 62 in partial scattering (“partially ballistic transport”) with otherparticles and can still maintain their kinetic energy 33 high enough anddirectional toward the interface of BG 62 and RD 64 to become electrons37. In all cases, such energized electrons 37 (termed “ballisticelectrons”) can surmount a barrier height 20 of the Image-Force barrier24 ₆₄ in mechanism as described in connection with FIGS. 1A and 1B,entering a conduction band 18 ₆₄ of RD 64, making their way therethrough to become electrons 37′ having an energy distribution 38′ ontheir population, and finally got collected and stored on CSR 66 aselectrons 71 in the conduction band 18 ₆₆. Such process in forming andinjecting charges (either in the ballistic transport or in the partiallyballistic transport) is termed as ballistic-charge injection mechanism.When electrons are selected as the charge carriers, such mechanism istermed as ballistic-electron injection mechanism. Typically, the energydistribution of the energized charge carriers (electrons 37) has anenergy spectrum in the range of about 30 meV to about 300 meV. Theinjection efficiency (defined as the ratio of number of carrierscollected to the number of carriers supplied) of such electronstypically ranges from about 10⁻⁴ to about 10⁻¹.

The ballistic-charge injection shown in FIG. 5 illustrates theballistic-electron injection and is done by applying a voltage betweenTG 61 and BG 62 such that electrons 37 have a kinetic energy 33 higherthan the Image-Force barrier height 20 of the conductor-insulator system60. Such voltage can be lowered by lowering barrier height 20 of theImage-Force barrier 24 ₆₄ by using means as described in connection withFIGS. 1A and 1B. This can be done by for example coupling a positivevoltage (e.g. from about +1 V to about +3 V) to CSR 66. Alternately, thebarrier height 20 can be lowered by choosing material for CSR 66 havinga smaller work-function (or a higher Fermi-level energy) than that of BG62.

For the example shown in FIG. 5, when applying voltage having polarityto inject electrons 56 in TG 61 along the forward direction 34, itsimultaneously induces holes LH 72 and HH 73 in BG 62 to transport alongthe backward direction 74. The backward transporting LH 72 and HH 73 canresult in undesired problems. For example, it can triggerimpact-ionization in TG 61 when they got backward transported into thatregion due to their higher energy than the valence band 44 ₆₁. Further,these holes do not contribute to memory operation when employing theballistic-electron-injection for a program operation of a memory cell.Therefore, it can waste electrical current and hence power. It is thusdesirable to block LH 72 and HH 73 from backward transporting into TG61.

The energy band structure in FIG. 5 shows the backward-transportingcarriers (i.e. LH 72 and HH 73) has to transport through more barriersin the filter 52 than the forward-transporting carriers (i.e. electrons56) do, and hence the filter provides charge-filtering effect onblocking the backward-transporting carriers. The filtering effect isbased on the energy band structure constructed by potential barriers infilter 52. A first potential barrier 42 ₅₄ blocking the backwardtransporting holes 72 and 73 comprises barrier heights 41 ₅₄ and 41′₅₄at an entrance side and at an exit side of barrier 42 ₅₄, respectively.Both barrier heights 41 ₅₄ and 41′₅₄ are referenced to valence band 44₅₄ of BD 54. A second potential barrier 42 ₅₃ having a barrier height 41₅₃ at its entrance side forms another barrier blocking holes 72 and 73.The barrier height 41 ₅₃ is referenced to valence band 44 ₅₃ of TD 53 atthe interface between TD 53 and BD 54.

Typically, the charge-filtering function is maximized by choosingmaterials for TD 53 and BD 54 such that a product of the dielectricconstant of BD 54 and the thickness of TD 53 is substantially greaterthan a product of the dielectric constant of TD 53 and the thickness ofBD 54.

One specific embodiment on the conductor-filter and conductor-insulatorsystems 59 and 60 that is used for the charge-injection system comprisesa p+ polysilicon for TG 61, an oxide layer for TD 53, a nitride layerfor BD 54, an n+ polysilicon for BG 62, and an oxide layer for RD 64.The n+ polysilicon is considered for BG 62 due to severalconsiderations. A major consideration lies in the much higher solidsolubility for n-type impurities (e.g. Arsenic, phosphorous etc) thanthat for p-type impurities (e.g. Boron). Impurity with a higher solidsolubility is desirable as it usually can dope the silicon heavier toresult in a lower sheet resistance, and is favorable for integratedcircuits (IC) application. In the embodiment, polysilicon is employed asthe material for TG 61 and BG 62 due to its well proven yield,manufacturability, and compatibility with state of the art ICtechnology. An oxide with a thickness of about 7 nm to 10 nm is employedfor RD 64 due to the same reason. The oxide layer used for TD 53 can bewith a thickness in the range of about 1.5 nm to 4 nm and preferably inthe range of about 2 nm to 3.5 nm. The thickness of TD 53 layer ischosen in the range where charge-carriers (electrons, LH or HH)transporting across the layer are primarily through the direct tunnelingmechanism. The thickness of BD 54 is chosen to block any type ofcharge-carriers from tunneling transport through both BD 54 and TD 53layers when a modest voltage in the range of about 1 V to about 2.5V isapplied between TG 61 and BG 62. The thickness of BD 54 is furtherchosen to permit one type of charge carriers (e.g. electrons)transporting in the forward direction and to block the other type ofcharge carriers (e.g. LH) from transporting in the backward directionwhen in a higher voltage range (3V or higher). The selection onthickness of BD 54 is also determined by it dielectric constant. Ingeneral, the thickness of BD 54 can be thinner or thicker than that ofTD 53 provided filter 52 can effectively meet the forgoing requirements.For example, in the specific embodiment here, if an oxide with 3 nm (or30 Å) is chosen for TD 53, then the minimum thickness for BD 54 can beabout 2 nm (or 20 Å) or thicker. For the specific embodiment, thenitride for BD 54 can be a high quality nitride without charge trappingcenters in its band gap. This high quality nitride can be formed in NH₃(ammonia) ambient at a high temperature (e.g. in range from 900° C. to1100° C.) by using, for example, RTN (Rapid Thermal Nitridation)technique well-known in the art. The oxide for TD 53 can be a HTO (hightemperature oxide) or a TEOS layer formed by using conventional CVDdeposition techniques such as LPCVD, RTCVD and the like. Alternately, TD53 can be a thermal oxide formed by oxidizing the nitride of BD 54 at ahigh temperature (e.g. in range from 900° C. to 1000° C.) by usingthermal oxidation technique well-known in the art. Such techniqueprovides a conversion process converting a portion of the nitride of BD54 to a layer of oxide for the TD 53 with a transition layer ofoxynitride formed there between. Typically, the oxynitride layer has athickness in the range of about 0.5 nm to about 2 nm. It should be notedthat during such nitride-to-oxide conversion process, a loss on nitridethickness has an effect on the final thickness for BD 54. Therefore, tomeet the desired thicknesses for BD 54 and TD 53 of the specificembodiment, a thicker nitride, such as 3.5 nm, need be considered instep prior to the oxidation to compensate the nitride loss during theoxidation.

While oxide and nitride are shown as the materials for TD 53 and BD 54,respectively, in the specific embodiment, such showing is only by way ofexample and any other types of dielectric materials and theircombination can be readily employed for TD and BD. For example, inanother embodiment, TD 53 can comprises oxide having a thickness in arange of about 1.5 nm to about 4 nm and BD 54 can comprises materialselected from the group consisting of nitride, oxynitride, Al₂O₃, HfO₂,TiO₂, ZrO₂, Ta₂O₅, and alloys formed thereof. In still anotherembodiment, TD 53 can comprises oxynitride having a thickness in a rangeof about 1.5 nm to about 4 nm and BD 54 can comprises material selectedfrom the group consisting of nitride, Al₂O₃, HfO₂, TiO₂, ZrO₂, Ta₂O₅,and alloys formed thereof.

The forgoing illustration on the ballistic-charge-injection is made onelectrons. Similar illustration can be readily made for light-holes andheavy-holes to achieve similar effects on charge filtering andinjection.

FIG. 6 provides an energy band diagram to illustrate theballistic-charge-injection and filtering effect for holes in thecharge-injection system of the FIG. 5 type. In the conductor-filtersystem 59 of FIG. 6, the conductor, TG 61, supplies thermal chargecarriers 75 and 76. The filter 52 contacts the conductor, TG 61, andincludes dielectrics 53 and 54 for providing a filtering function on thecharge carriers 75 and 76 of one polarity (positive charge carriers),wherein the filter includes electrically alterable potential barriers 42_(53b) and 42 _(54b) for controlling flow of the charge carriers 75 and76 of one polarity through the filter 52 in one direction (forwarddirection 34). In addition to controlling the one polarity of chargecarriers (positive charge carriers 75 and 76), the filter 52 furtherincludes electrically alterable potential barriers 24 _(53b) and 24_(54b) for controlling the flow of charge carriers of an oppositepolarity (negative charge carriers, electrons 84) through the filter inanother direction (backward direction 74) that is substantially oppositeto the one direction.

Such filtering function permits charge carriers of one polarity typetransporting along the forward direction 34 and blocks charge carriersof an opposite polarity type transporting along a backward direction 74.Thus, the filter 52 provides a charge-filtering function that can“purify” the charge flow. The charge-filtering function is anotherembodiment of the filtering function of filter 52, and is similar to thecharge-filtering function as described in connection with FIG. 5.

Referring to FIG. 6, there is shown LH 75 and HH 76 in the valence band44 ₆₁ of TG 61 as the supplied carriers for injection. LH 75 and HH 76are shown transporting along the forward direction 34 in an energydistribution 77 on their population. Although energy distribution for LH75 and HH 76 are shown in same distribution 77, it is noted that LH 75and HH 76 can have different energy distributions on their populationdue to differences on their effective masses.

In FIG. 6, both LH 75 and HH 76 are shown transporting through barriersof filter 52 in quantum mechanical tunneling mechanism to become LH 75′and HH 76′ having a kinetic energy 46 with respect to the valence band44 ₆₂ of BG 62 that is slightly higher than a barrier height 41 of anImage-Force barrier 42 ₆₄. When these carriers transport further alongthe forward direction, their transport behaviors through BG 62 are verydifferent due to their difference on effective mass. For HH 76′, due totheir heavy effective mass, the mean-free-path can be very short.Therefore, HH 76′ are prone to experience scattering events with otherparticles (e.g. phonons), and have low ballistic transport efficiency(“ballisticity”). In FIG. 6, HH 76′ are shown experiencing scatteringevents and losing their energy to become HH 79. Further, these scatteredHH 79 are shown having a broad energy distribution 81 than original one77 due to scattering. Such holes 79 are shown transporting at energybelow the barrier height 41 of Image-Force barrier 42 ₆₄ at the valenceband 44 ₆₄ of RD 64, and hence are blocked from transporting overbarrier 42 ₆₄ and cannot enter CSR 66. In a contrast, the LH 75′ has alighter effective mass, and hence a much longer mean-free-path than thatof HH 76′ (for example, in silicon, the mean-free-path of LH is about 3times of that of HH). In one case, a portion of these LH 75′ cantransport through BG 62, without scattering (i.e. in ballistictransport), at the kinetic energy 46 to become energized charge carriersLH 78 at the interface of BG 62 and RD 64. Such LH 78 do not experiencescattering with other particles (e.g. phonons), and hence can conservetheir kinetic directional energy and momentum along original movementand their energy distribution 80 similar to the original one 77. Inanother case, LH 75′ can transport through BG 62 in the partialballistic scattering, and still can maintain their kinetic energy 46high enough and directional toward the interface of BG 62 and RD 64 tobecome LH 78. In all cases, such LH 78 (termed “ballistic light-hole” or“ballistic LH”) can surmount the barrier height 41 of the Image-Forcebarrier 42 ₆₄ in mechanism as described in connection with FIG. 2,entering a valence band 44 ₆₄ of RD 64, making their way there throughto become LH 78′ having an energy distribution 80′ on their population,and finally got collected and stored on CSR 66 as holes 82 in thevalence band 44 ₆₆. Such process in filtering and injecting hole charges(either in the ballistic transport or in the partially ballistictransport) is termed as ballistic-holes-injection mechanism. Typically,the energy distribution 80 of the energized charge carriers (LH 78) hasan energy spectrum in the range of about 30 meV to about 300 meV. Theinjection efficiency (defined as the ratio of number of carrierscollected to the number of carriers supplied) of such holes typicallyranges from about 10⁻⁶ to about 10⁻³.

For the specific embodiment on materials for systems 59 and 60 asdescribed in connection with FIG. 5, voltage of TG 61 is chosen in therange of about +5 V to about +6.0 V relative to voltage of BG 62 for theballistic-holes-injection. Such voltage can be further lowered bylowering the Image-Force barrier height 41 of the conductor-insulatorsystem 60 as described in connection with FIG. 2. This can be done byfor example coupling a voltage in the range of about −1 V to about −3 Vto CSR 66. Alternately, the Image-Force barrier height can be lowered bychoosing material for CSR 66 having a larger work-function (or a lowerFermi-level energy) than that of BG 62. For example, p-type polysiliconhas a lower Fermi-level energy than that of n-type silicon, and thusp-type polysilicon and n-type silicon are considered as one embodimenton materials for CSR 66 and BG 62, respectively.

The voltage applied between TG 61 and BG 62 can be further reduced byemploying materials having similar Fermi-level energy for these regions.This constitutes another specific embodiment on materials for systems 59and 60 for the ballistic-hole-injection. For example, thecharge-injection system can comprise a p+ polysilicon for TG 61, anoxide layer for TD 53, a nitride layer for BD 54, a p+ polysilicon forBG 62, and an oxide layer for RD 64. Such embodiment allows voltage ofTG 61 relative to voltage of BG 62 be chosen in a lower range (e.g. fromabout +4.5 V to about +5.5 V) for the ballistic-holes-injection.

FIG. 6 further shows that electrons 84 in conduction band 18 ₆₂ of BG 62can transport along the backward direction 74 while biasing the energyband structure in the voltage polarity for transporting LH 75 and HH 76along the forward direction 34. The backward transporting electrons 84can result in undesired problems such as impact-ionization in TG 61,current and power waste etc. that are similar to those problems causedby backward transporting holes as described in connection with FIG. 5.It is thus desirable to block electrons 84 from backward transportinginto TG 61 by using the filter 52.

The energy band structure in FIG. 6 shows the backward-transportingcarriers (i.e. electrons 84) have to transport through more barriersthan the forward-transporting carriers (i.e. LH 75 and HH 76) do. Afirst electron barrier 24 _(54b) blocking the backward transportingelectrons 84 comprises barrier heights 20 _(54b) and 20′_(54b) at anentrance side and an exit side, respectively, of the barrier 24 _(54b).Barrier heights 20 _(54b) and 20′_(54b) are referenced to conductionband 18 ₅₄ of BD 54 at interface between BD 54 and BG 62 and between TD53 and BD 54, respectively. A second electron barrier 24 _(53b) is shownhaving a barrier height 20 _(53b) at its entrance side and forms anotherbarrier blocking electrons 84. The barrier height 20 _(53b) isreferenced to conduction band 18 ₅₃ of TD 53 at the interface between TD53 and BD 54. A barrier height 20′_(53b) (not shown) exists at an exitside of barrier 24 _(53b), and is referenced to conduction band 18 ₅₃ ofTD 53 at the interface between TG 61 and TD 53. In the example shownhere, barrier height 20′_(53b) is below the energy level of electrons84, and hence is not shown in FIG. 6. Both barriers 24 _(54b) and 24_(53b) form an energy band structure in the conduction band of filter 52to block backward-transporting electrons 84.

There are two similar barriers for holes 75 and 76 on their transportingpath along the forward direction 34. A first potential barrier 42 _(53b)is formed by TD 53 and has barrier heights 41 _(53b) and 41′_(53b) atthe entrance and the exit sides, respectively, of barrier 42 _(53b). Asecond barrier 42 _(54b) is formed by BD 54 and has barrier heights 41_(54b) and 41′_(54b) (not shown) at the entrance and the exit sides ofbarrier 42 _(54b), respectively. Both the first and the second barriers42 _(53b) and 42 _(54b) form energy band structure in the valence bandof filter 52 and have effect on blocking the forward transporting holes75 and 76. In FIG. 6, the energy band structure is biased to injectholes. Both barrier heights 41 _(54b) and 41′_(54b) are below the energylevel of forward transporting holes, and hence are not shown in FIG. 6.

The filter 52 further provides another filtering function in accordancewith the present invention. Such filtering function permits chargecarriers of one polarity type and having lighter mass (e.g. LH) totransport through the filter, and blocks charge carriers of the samepolarity type and having a heavier mass (e.g. HH) from transportingthere through. Thus, the filter 52 provides a mass-filtering functionthat can filter the charge carrier flows based on their mass.

FIG. 7 illustrates the basis of the mass-filtering function of thefilter 52. The mass-filtering function can be better captured byreferring back to FIG. 6. In the conductor-filter system 59 of FIG. 6,the conductor 61 supplies thermal charge carriers (LH 75 and HH 76). Thefilter 52 contacts the conductor 61 and includes dielectrics 53 and 54for providing a filtering function on the charge carriers 75 and 76 ofone polarity (positive charge carriers), wherein the filter includeselectrically alterable potential barriers 42 _(53b) and 42 _(54b) forcontrolling flow of the charge carriers 75 and 76 of one polaritythrough the filter 52 in one direction (forward direction 34).

It is known in quantum mechanics theory that tunneling probability ofcharge carriers is a function of their mass, and the heavier carriers(e.g. HH 76) can have a tunneling probability lower than that of thelighter one (e.g. LH 75). FIG. 7 shows normalized tunneling probabilitycalculated for LH and HH and is plotted as a function of the reciprocalof V_(TD) to illustrate the mass-filtering function of filter 52. In theillustration, filter 52 is assumed comprising TD 53 of oxide having 3 nmon thickness and BD 54 of nitride having 2 nm on thickness. For therange of voltage (+5 V to +6 V) that is applied between TG 61 and BG 62for ballistic-hole injection, the tunneling probability of HH is shownlower than that of LH by about 4 to about 8 orders of magnitude. Thedifference on tunneling probability due to the effect of carrier massespermits mass-filtering function realized in the filter 52. Although theillustration made herein is on hole carriers, the same illustration canbe readily extended to other types of carriers having same polarity typebut different mass. The mass-filtering function is another embodiment ofthe filtering function of filter 52.

The mass-filtering function of filter 52 and its application on passingLH brings desirable advantages to the present invention. For example, itcan avoid wasting on the supplied carriers of TG 61 that are used forballistic injection. This is because the majority population of the holecarriers in TG 61 are of the HH type, which has a shorter mean-free-pathand prone to experience scattering events when transporting across BG62. Such HH cannot efficiently contribute to the ballistic injection andthus are wasted when employed as the supplied carriers. By filtering outthe HH through the mass-filter function of filter 52, the primarysupplied carriers are now limited to LH carriers only. LH carriers havea longer mean-free-path and can more efficiently contribute to theballistic injection while transporting through BG 62 via mechanismdescribed in connection with FIG. 6. As a result, the mass-filteringfunction of filter 52 provides feature on selecting carriers having highballisticity as the supplied carriers, and hence avoids waste onsupplied current by carriers of low ballisticity.

The filter 52 of the conductor-filter system 59 provides uniquefiltering functions. It provides the band-pass filtering function asdescribed in connection with FIG. 3, the charge-filtering function asdescribed in connection with FIGS. 5 and 6, and the mass-filteringfunction as described in connection with FIG. 7. It should be clear tothose of ordinary skill in the art that the teachings of this disclosurecan be applied to modify the dielectrics and/or architecture of thefilter through which these functions can be tailored individually orcollectively. For example, the filter can contain more than twodielectrics to enhance its charge-filtering function. Further, thedielectrics of filter need not be having a uniform chemical element butrather can have a graded composition on its element that can effectivelysupport these functions. Moreover, the dielectrics need not be in directcontact to each other but rather can have a transition layer, asdescribed in connection with FIG. 5, disposed there between. It is thusunderstood that the present invention is not limited to the illustratedherein and embodiments described above, but encompasses any and allvariations falling within the scope of the appended claims.

The Memory Cells of the Present Invention Embodiment 100

FIG. 8 shows a cross-sectional view of cell architecture 100 inaccordance with one embodiment on cell structure of the presentinvention. Referring to cell 100 of FIG. 8, there is shown a body 70 ofa semiconductor material having a first conductivity type, aconductor-filter system 59 of the type described in connection withFIGS. 3, 5 and 6 having a first conductor 61 and a filter 52, aconductor-insulator system 60 of the type described in connection withFIGS. 1A and 2 having a second conductor 97 and a first insulator 64.The cell 100 further comprises a source 95 spaced-apart from the secondconductor 97 (drain 97) with a channel 96 of the body 70 defined therebetween, a second insulator 64′ adjacent to the source 95, a chargestorage region (“CSR”) 66 in the form of a floating gate (“FG”) 66 ₁₀₀disposed in between the first and the second insulators 64 and 64′, anda word-line (“WL”) 92 of a conductor. The body 70 is in or atop of asubstrate 98 (such as a silicon substrate or a silicon-on-insulatorsubstrate). An optional buried well 99 is provided in between the body70 and the substrate 98 to isolate the body 70 from the substrate 98.

The WL 92 comprises a first portion 94 disposed over and insulated fromthe CSR 66 by a stack of coupling dielectrics including a floating-gatedielectric (“FD”) 93, and a second portion 61 disposed over andinsulated from the body 70 by a stack of dielectrics including a fieldoxide (“FOX”) 90. The second portion 61 of WL 92 corresponds to thefirst conductor 61 of the conductor-filter system 59 for supplyingcharge carriers having tight energy distribution as described inconnection with FIGS. 3, 5 and 6. Materials for WL 92 can be from thegroup comprising a semiconductor, such as n+ polysilicon, p+polysilicon, heavily-doped poly-SiGe etc, or a metal, such as aluminum(Al), platinum (Pt), Au, Tungsten (W), Molybdenum (Mo), ruthenium (Ru),tantalum (Ta), nickel (Ni), tantalum nitride (TaN), titanium nitride(TiN) etc, or alloy thereof, such as tungsten-silicide, nickel-silicideetc. While WL 92 in cell 100 is shown in a single layer, it may comprisemore than one layer in architecture. For example, WL 92 can comprise anickel-silicide layer formed atop of a polysilicon layer. Such structureforms a stack of conductive layers as one conductor for WL 92. Thethickness of WL 92 can be in the range from about 80 nm to about 500 nm.

The conductor-filter system 59 of cell 100 comprises the first conductor61 as a tunneling-gate (“TG”) 61, and the filter 52, wherein TG 61corresponds to the conductor of the system 59. The filter 52 providesthe band-pass filtering function as described in connection with FIG. 3,the charge-filtering function as described in connection with FIGS. 5and 6, and the mass-filtering function as described in connection withFIG. 7. In a preferred embodiment, the filter 52 comprises a tunnelingdielectric (“TD”) 53 and a blocking dielectric (“BD”) 54 described inconnection with FIG. 3.

The conductor-insulator system 60 comprises the drain 97 and a retentiondielectric (“RD”) 64 as the conductor 10 and insulator 12 of the systemof FIG. 1A, respectively.

The cell structure in regions from TG 61 to RD 64 is constructed by“contacting” the filter 52 of the conductor-filter system 59 to theconductor (drain 97) of the conductor-insulator system 60. The TG 61 isdisposed adjacent to and insulated from the drain 97 by the filter 52.The structure thus formed has TD 53 sandwiched in between the TG 61 andthe BD 54, and has BD 54 sandwiched in between the TD 53 and the drain97. The drain 97 is disposed adjacent to and insulated from the FG 66₁₀₀ by the retention dielectric (RD 64). Likewise, the source 95 isdisposed adjacent to and insulated from the FG 66 ₁₀₀ by a sourceretention dielectric (SRD 64′). The TG 61 overlaps the drain 97 to forman overlap 63 between the two, where at least a portion of FG 66 ₁₀₀ isdisposed adjacent thereto. The overlap 63 is essential in the cellstructure as supplied charge carriers of TG 61 are filtered through thatportion of the filter 52 in order to be transported through drain 97, RD64 and finally into the FG 66 ₁₀₀. The FG 66 ₁₀₀ is for collecting andstoring such charge carriers and can be polysilicon, poly-SiGe or anyother types of semiconductor materials that can effectively storecharges. The conductivity of FG 66 ₁₀₀ can be an n-type or a p-type. TheFG 66 ₁₀₀ is disposed adjacent to and insulated from the body 70 by achannel dielectric (“CD”) 68. The FG 66 ₁₀₀ is typically encapsulatedand insulated by dielectrics such as RD 64, SRD 64′, CD 68, or otherdielectrics in close proximity having proper thickness and goodinsulation property to retain charges thereon without leaking. In aspecific embodiment, material for RD 64, SRD 64′ and CD 68 aredielectrics of the oxynitride system SiO_(x)N_(1-x), and the fractionaloxide x of these regions can be identical or can be different. Forexample, RD 64 and CD 68 can comprise pure oxide (i.e. x=1), and SRD 64′can comprise oxynitride having x=0.9. Further, RD 64, SRD 64′ and CD 68can comprise dielectric having a uniform chemical element or a gradedcomposition on its element. The thicknesses of regions 64, 64′ and 68are typically in the range from about 5 nm to about 20 nm, and can beidentical or different from each other. One consideration in selectingthe thickness for SRD 64′ and RD 64 is a coupling coefficient, whichcouples voltage from source 95 to CSR 66. It is desired that thiscoefficient be maximized. This coefficient can be greatly maximized bychoosing a thinner thickness for SRD 64′. For example, thickness for RD64 is preferably in the range from 7 nm to 15 nm, while the thicknessfor SRD 64′ is in the range from 5 nm to 9 nm.

TD 53 and BD 54 can comprise dielectrics having a uniform chemicalelement or a graded composition on its element. TD 53 and BD 54 can bedielectric materials from the group comprising oxide, nitride,oxynitride, aluminum oxide (“Al₂O₃”), hafnium oxide (“HfO₂”), zirconiumoxide (“ZrO₂”), tantalum pen-oxide (“Ta₂O₅”). Furthermore, anycomposition of those materials and the alloys formed thereof, such ashafnium oxide-oxide alloy (“HfO₂—SiO₂”), hafnium-aluminum-oxide alloy(“HfAlO”), hafnium-oxynitride alloy (“HfSiON”) etc. can be used asdielectric materials for TD and BD. In the preferred embodiment, anoxide dielectric having thickness from 2 nm to 4 nm and a nitridedielectric having thickness ranging from about 2 nm to 5 nm are chosenfor TD 53 and BD 54, respectively.

The body 70 comprises a semiconductor material of a first conductivitytype (e.g. p-type) having doping level in the range of about 1×10¹⁵atoms/cm³ to about 1×10¹⁸ atoms/cm³. The CSR 66, drain 97 and source 95are with widths typically in the range from about 20 nm to about 200 nmand have depths in similar range. Both drain 97 and source 95 aresemiconductor heavily doped by impurity of a second conductivity type(e.g. n-type) having doping level in the range of about 1×10¹⁸ atoms/cm³to about 5×10²¹ atoms/cm³. Both drain 97 and source 95 can be materialsselected from the group including silicon and single crystal SiGe(“SiGe”), and can comprise same semiconductor as that of the body 70, oralternatively, can comprise semiconductor different from that of thebody 70. For example, drain, source and body can comprise same materialsuch as silicon. Alternatively, drain and source can be of SiGe, andbody can be of silicon. Typically, SiGe is in the form of pseudomorphicSi_(1-x)Ge_(x) alloys with Ge mole fraction x ranging from about 5percent to about 50 percent, and can be grown on silicon substratesusing conventional epitaxy techniques.

The buried well 99 comprises a semiconductor material of the secondconductivity type (e.g. n-type) having doping level in the range ofabout 1×10¹⁵ atoms/cm³ to about 1×10¹⁸ atoms/cm³. The doping in regionsdescribed above may be formed by thermal diffusion or by ionimplantation.

The memory cell 100 further comprises means for supplying andtransporting energized charge carriers in the drain 97 onto the CSR 66for program and erase operations of the memory cell. The programoperation of memory cell 100 can be done by employing theballistic-electron injection mechanism as described in connection withFIG. 5. These injection mechanisms inject energized charge carriershaving energy distribution with an energy spectrum in the range of about30 meV to about 300 meV onto CSR 66. For the specific embodiment,typical voltage of TG 61 is chosen in the range of about −3.3 V to about−4.5 V relative to voltage of drain 97 to form a voltage droptherebetween for injecting electrons having tight energy distributionand energy. This can be done, for example, by applying a −1.8 V voltageto WL 92 and a +1.5 V voltage to drain 97 to generate the −3.3 V voltagedrop across TG 61 and drain 97. Alternately, it can be done by applyingother voltage combinations, such as −1.5 V to WL 92 and +1.8 V to drain97. The voltage drop across TG 61 and drain 97 can be further lowered bylowering the Image-Force barrier height of the conductor-insulatorsystem 60 as described in connection with FIGS. 1A and 1B. This can bedone by coupling a voltage in the range of about 1 V to about 3 V to CSR66 through applying voltages in the range of about 1 V to about 3.3 V tosource 95 and to body 70. For example, assuming 10 nm and 7 nm for thethickness of RD and SRD 64′, such Image-Force lowering effect can reducethe −3.3 V voltage drop across TG 61 and drain 97 to a range of about−2.8 V to about −3.0 V.

While applying the voltages for program operation, care is taken toavoid forward-biasing parasitic junctions such as one between buriedwell 99 and body 70 when employing buried well 99 for isolating body 70from substrate 98. This is typically done by keeping buried well 99 atvoltage level same as or similar to that of the body 70.

The FG 66 ₁₀₀ of CSR 66 is negatively charged with electron carriersafter the cell 100 is programmed to a program state. The programmedstate of cell 100 is erased by performing the erase operation.

The erase operation can be done by employing the ballistic-holeinjection mechanism as described in connection with FIG. 6. Theseinjection mechanisms inject energized charge carriers having energydistribution with an energy spectrum in the range of about 30 meV toabout 300 meV onto CSR 66. For the specific embodiment, voltage of TG 61is chosen in the range of about +5 V to about +6 V relative to voltageof drain 97 to form a voltage drop therebetween for injectinglight-holes having tight energy distribution. This can be done, forexample, by applying a +3 V voltage to WL 92 and a −2 V voltage to drain97 to generate the +5 V voltage drop across TG 61 and drain 97.Alternately, it can be done by applying other voltage combinations, suchas +2.5 V to WL 92 and −2.5 V to drain.

There are situations where the magnitude of voltage drop across TG 61and drain 97 for the erase operation is quite different from that forthe program operation. For example in the specific embodiment, themagnitude of voltage drop across TG 61 and drain 97 for the eraseoperation is larger than that for the program operation by about 1.5 V.Generally, it is desired to use means to reduce the differences betweenthese magnitudes. One such means on reducing the voltage magnitudebetween TG 61 and drain 97 for the erase operation is by employingmaterials having similar Fermi-level energy for these regions. Forexample, both TG 61 and drain 97 can comprise a p+ polysilicon. Anothersuch means is by lowering the Image-Force barrier height of theconductor-insulator system 60 as described in connection with FIG. 2. Inaccordance with one embodiment of the present invention, the Image-Forcebarrier height is lowered by choosing material for CSR 66 having alarger work-function (or a lower Fermi-level energy) than that of drain97. For example, p-type polysilicon has a lower Fermi-level energy thanthat of n-type silicon, and thus a p-type polysilicon and a n-typesilicon are considered as one embodiment for materials of CSR 66 anddrain 97, respectively. The Image-Force barrier is somewhat lowered whenCSR 66 is negatively charged, and is generally further lowered bycoupling a voltage in the range of about −1 V to about −3 V to CSR 66through applying voltages in the range of about −1 V to about −3.3 V tosource 95 and body 70. For example, assuming 8 nm for the thickness ofRD 64, such Image-Force lowering effect can reduce the +5 V voltage dropacross TG 61 and drain 97 to a range of about +4.5 V to about +4.7 V.

During the erase operation, the voltages of buried well 99 can betypically held at ground level when buried well 99 is employed in cell100 for isolating body 70 from substrate 98.

Finally, to read the memory cell, a read voltage of approximately +1.25V is applied to its source 95 and approximately +2.5 V (depending uponthe power supply voltage of the device) is applied to WL 92. Otherregions (i.e. drain 97 and body 70) are at ground potential. If the FG66 ₁₀₀ is positively charged (i.e. CSR 66 is discharged of electrons),then the channel 96 is turned on. Thus, an electrical current will flowfrom the source 95 to the drain 97. This would be the “1” state. On theother hand, if the FG 66 ₁₀₀ is negatively charged, the channel 96 iseither weakly turned on or is entirely shut off. Even when WL 92 anddrain 97 are raised to the read voltage, little or no current will flowthrough channel 96. In this case, either the current is very smallcompared to that of the “1” state or there is no current at all. In thismanner, the memory cell is sensed to be programmed at the “0” state.

Embodiment 200

Turning now to FIG. 9, some variations of the cell 100 of FIG. 8 arepresented in a memory cell 200. The cell 200 is in all respect excepttwo the same as cell 100 of FIG. 8. One of the differences is thatinstead of having the drain 97 in one region, the cell 200 is providedwith the drain 97 having more than one region including a drainconnector 97 ₁ and a drain junction 97 ₂. The drain junction 97 ₂contacts the drain connector 97 ₁ and is disposed there under. Likewise,the source 95 has more than one region including a source junction 95 ₂disposed under and contacting a source connector 95 ₁ to collectivelyform the source 95 of cell 200. The source connector 95 ₁ and drainconnector 97 ₁ can be in a rectangular shape having a width and athickness in the range of about 50 nm to about 500 nm. The drainjunction and source junction 97 ₂ and 95 ₂ are semiconductor regions inthe body 70, and are junctions such as p-n junction ormetal-semiconductor junction (also termed “Schottky junction”) havingrectifying function well-known in the art. For an embodiment on p-njunction, the drain and source junctions 97 ₂ and 95 ₂ are diffusionregions heavily doped by impurity of the second conductivity type (e.g.n-type) having doping level in the range of about 1×10¹⁸ atoms/cm³ toabout 5×10²¹ atoms/cm³. The conductivity type (e.g. n-type) of junctions97 ₂ and 95 ₂ are different than the conductivity type (e.g. p-type) ofthe body 70 to form the p-n junctions for these regions. The doping inthese regions may be formed by thermal diffusion or by ion implantation.Typical depths of the source and drain diffusions 95 ₂/97 ₂ into thebody 70 are in the range of about 20 nm to about 200 nm. For anembodiment on Schottky junction, the drain and source junctions 97 ₂ and95 ₂ are semiconductor having Schottky barrier formed at interfacebetween their respective connectors 97 ₁ and 95 ₁.

Similar to cell 100, the TG 61 of cell 200 overlaps the drain 97 to forman overlap 63 between the two, where at least a portion of FG 66 ₁₀₀ isdisposed adjacent thereto. The range of the overlap 63 can cover aportion of the drain connector 97 ₁, an entire portion of the drainconnector 97 ₁, the entire portion of the drain connector 97 ₁ and aportion of the drain junction 97 ₂, or an entire portion of the drain97, including the drain connector 97 ₁ and the drain junction 97 ₂.

In one embodiment of cell 200, both drain connector 97 ₁ and sourceconnector 95 ₁ are of semiconductor material such as polysilicon,poly-SiGe, and SiGe having high doping concentration (e.g. doping levelof n-type impurities (e.g. arsenic) on the order of 10²⁰ atoms/cm³). Thesource connector 95 ₁ and drain connector 97 ₁ can be formed by usingwell-known CVD techniques such as LPCVD, RTCVD and the like (forpolysilicon and poly-SiGe), or by using expitaxy technique (for SiGe).The doping in these regions may be formed by in-situ, by thermaldiffusion or by ion implantation. The source junction 95 ₂ and drainjunction 97 ₂ of cell 200 can be formed in a self-aligned manner totheir respective connectors 95 ₁ and 97 ₁ by out-diffusing impuritiesfrom their respective connectors into body 70. For example, the impurityin source connectors 95 ₁ can be diffused into body 70 to form thesource junction 95 ₂ self-aligned to the source connector 95 ₁.

In another embodiment of cell 200, both drain connector 97 ₁ and sourceconnector 95 ₁ are metal, such as aluminum (Al), platinum (Pt), Au,tungsten (W), molybdenum (Mo), ruthenium (Ru), tantalum (Ta), nickel(Ni), tantalum nitride (TaN), titanium nitride (TiN) etc, or alloythereof. Further, such metal can be silicide or polycide materials suchas platinum-silicide, tungsten-silicide, tungsten-polycide,nickel-silicide, cobalt-silicide, etc. The advantages of this embodimenton cell structure are the much lower sheet resistance for the source 95and drain 97 due to the low sheet resistance of the source and drainconnectors 95 ₁/97 ₁. For example, Tungsten-polycide has asheet-resistance typically about 1 to 10 Ohms/square, and issignificantly lower than that in an un-metalized heavily dopedpolysilicon, whose sheet-resistance is typically about 100 to 300Ohms/square. The source and drain junctions 95 ₂ and 97 ₂ of cell 200can be formed in a self-aligned manner by out-diffusing impurities fromtheir respective connectors 95 ₁ and 97 ₁. For example, this can be doneby ion implanting heavy impurity of the second type conductivity, suchas arsenic, into connectors 95 ₁ and 97 ₁, such as tungsten-polycide,and later followed by thermal treatments to out-diffusing the impurityinto body 70. Such approach forms drain and source junctions 97 ₂ and 95₂ of the p-n junction type. Alternatively, the source and drainjunctions 95 ₂ and 97 ₂ of cell 200 can be formed self-aligned to theirrespective connectors 95 ₁ and 97 ₁ by forming Schottky barrier atinterface between their respective junction and connector. Such approachforms drain and source junctions 97 ₂ and 95 ₂ of the Schottky junctiontype, and can be done by choosing materials having proper work-functionsfor the connectors. For example, for the body having the firstconductivity type (p-type), it is desired to select material having asmaller work-function than that of the body 70 as the materials for theconnectors 95 ₁ and 97 ₁. Such materials can form a Schottky barrier forcharge of a first polarity type, and can comprise rare earth silicides,such as erbium silicide (“ErSi₂”), Terbium silicide (“TbSi₂”), andDysprosium silicide (“DySi₂”), or other types of silicide, such asYtterbium silicide (“YbSi₂”). Alternatively, such materials can comprisemetal, such as molybdenum. Similarly, for the body having the secondconductivity type (n-type), it is desired to select material having alarger working function than that of the body 70 as the materials forthe connectors 95 ₁ and 97 ₁. Such materials can form a Schottky barrierfor charge of a second polarity type and can comprise platinum silicideand titanium silicide.

Cell 200 can be operated in similar way as that illustrated for cell 100in connection with FIG. 8.

The dimensions of the cells in accordance with the present inventionsare closely related to the design rules of a given generation of processtechnology. Therefore, the foregoing dimensions on cells and on regionsdefined therein are only illustrative examples. In general, however, thedimension of the memory cells must be such that supplied charges arefiltered and transported through the filter at a higher absolute voltagebetween TG and drain (e.g. 3 V to 6 V) and blocked by the filter at alower absolute voltage (e.g. 2.5 V or lower). Furthermore, thedimensions of the drain 97 and RD 64 must be such that a large portionof filtered charges are allowed to transport through these regions andbe collected by the CSR 66 at an injection efficiency typically rangingfrom about 10⁻⁶ to about 10⁻¹.

It is to be understood that the present invention is not limited to theillustrated herein and embodiments described above, but encompasses anyand all variations falling within the scope of the appended claims. Forexample, the cell 100 need not having both the conductor-filter systemand the conductor-insulator system in cell structure and operations, butrather can have the conductor-filter system or the conductor-insulatorsystem in the cell structure that effectively filter and transportcharge carriers to the CSR. Further, the dimension of width of CSR 66need not be smaller than that of the depth of CSR, but rather can beequal or greater than the dimension of the depth of CSR. Furthermore,the source and drain connectors 95 ₁ and 97 ₁ need not be a single layerbut rather they may comprise more than one layer of materials inarchitecture. Moreover, the source and drain junctions 95 ₂ and 97 ₂need not be formed in a self-aligned manner to their respectiveconnectors 95 ₁ and 97 ₁, but rather can be formed by usingnon-self-aligned techniques where alignment between the junctions andtheir respective connectors relies on masks definition and alignment ofthose masks. Additionally, both the source 95 and drain 97 need not behaving one region or having more than one region in the same call butrather one of the source and drain can have a one region while the otherhas more than one region. For example, the source 95 of a cell can haveone region shown in cell 100 and the drain 97 of the cell can have morethan one region, such as drain connector 97 ₁ and drain junction 97 ₂shown in cell 200.

Those of skill in the art will recognize that the means for supplyingand transporting energized charge carriers that are illustrated for theprogram and the erase operations of memory cells may be interchanged.For example, the program operation can be done by employing theballistic-hole injection mechanism, and the erase operation can be doneby employing the ballistic-electron injection mechanism.

The memory cells in accordance with the present invention can be formedin an array with peripheral circuitry including conventional row addressdecoding circuitry, column address decoding circuitry, sense amplifiercircuitry, output buffer circuitry and input buffer circuitry, which arewell known in the art.

The memory cells of these embodiments are typically arranged in arectangular array of rows and columns, wherein a plurality of cells areconstructed in NOR or NAND architecture well-known in the art. Thenonvolatile memory array of the present invention comprises a substrate,and a plurality of nonvolatile memory cells on the substrate andarranged in a rectangular array of rows and columns. Each of theplurality of nonvolatile memory cells comprises a body of asemiconductor material having a first conductivity type, aconductor-filter system including a first conductor 61 having thermalcharge carriers and a filter contacting the conductor and includingdielectrics for providing a filtering function on the charge carriers ofone polarity. The filter includes a first set of electrically alterablepotential barriers for controlling flow of the charge carriers of onepolarity through the filter in one direction, and a second set ofelectrically alterable potential barriers for controlling flow of chargecarriers of an opposite polarity through the filter in another directionthat is substantially opposite to the one direction. Each of the memorycells further comprises a conductor-insulator system including a secondconductor 97 having at least a portion thereof contacting the filter andhaving energized charge carriers from the filter, and a first insulatorcontacting the second conductor at an interface and having electricallyalterable Image-Force potential barriers adjacent to the interface.Moreover, each of the memory cells further comprises a first region 95spaced-apart from the second conductor 97 with a channel of the bodydefined there between, a second insulator adjacent to the first region,a charge storage region 66 disposed in between the first and the secondinsulators; and a third conductor 92′ having a first portion 94 disposedover and insulated from the charge storage region 66 and a secondportion comprising the first conductor 61 disposed over and insulatedfrom the body.

FIG. 10 illustrates an example on a NOR array architecture in schematicdiagram with illustration made on a plurality of memory cells such as100 ₁ to 100 ₆, 100 ₉ and 100 ₁₀ of the memory cell 100 of FIG. 8 type.FIG. 10 shows the nonvolatile memory array further comprising aplurality of word-lines 92, including lines 92 ₁, 92 ₂, and 92 ₃,oriented in a first direction (row direction). Each of the word-lines 92is shown connecting all the third conductors 92′ of memory cells in thesame row. For example, the word-line 92 ₁ connects the third conductors92′ of each of the memory cells in the uppermost row such as cells 100₁, 100 ₂, 100 ₃ and 100 ₄. Further, there is shown a plurality ofsource-lines 110, including lines 110 ₁ and 110 ₃, and a plurality ofbit-lines 130, including lines 130 ₁, 130 ₂, 130 ₃ and 130 ₄, alloriented in a second direction (column direction). Each of the bit-lines130 connects all the drains 97 of memory cells in the same column.Thereby, the bit-line 130 ₁ connects the drain 97 of each of the memorycells in the leftmost column including cells 100 ₁, 100 ₅ and 100 ₉.Likewise, each of the source-lines 110 connects all the sources 95 ofmemory cells in the same column. For example, the source-line 110 ₁connects the source 95 of each of the memory cells in the leftmostcolumn including cells 100 ₁, 100 ₅ and 100 ₉. Memory cells in onecolumn share a single source-line 110 with memory cells in an adjacentcolumn to form a column of multiple pairs of memory cells that mirroreach other (“mirror cells”). For example, cells 100 ₁ and 100 ₂ formsone pair of mirror cells and cells 100 ₅ and 100 ₆ forms another pair ofmirror cells that are in the same column as the one pair of mirrorcells. Thereby, each pair of mirror cells shares a single source 95therebetween and has their drain 97 and TG 61 on either side of themirror cells. One cell of one cell pair of mirror cells in one columnand one cell of another cell pair of mirror cells in a same row and inan adjacent column share a single TG 61 therebetween. For example,memory cell 100 ₂ shares TG 61 ₃ with memory cell 100 ₃. TG 61 of eachof the memory cells in the same row are connected together through oneof the word-lines 92. For example, the word-line 92 ₁ connects TG,including 61 ₁, 61 ₃, and 61 ₅, of memory cells in the uppermost rowsuch as cells 100 ₁, 100 ₂, 100 ₃ and 100 ₄.

Those of skill in the art will recognize that the term source and drainmay be interchanged, and the source- and drain-lines or source- andbit-lines may be interchanged. Further, the word-line is connected to TG61 of the memory cell. Thus, the term TG, TG line may also be usedinterchangeably with the term word-line.

The NOR array shown in FIG. 10 is an array architecture used as anexample to illustrate the array formation using memory cells of thepresent invention. It should be appreciated that while only a smallsegment of array region is shown, the example in FIG. 10 illustrates anysize of array of such regions. Additionally, the memory cells of thepresent invention can be applied to other types of NOR arrayarchitecture. For example, while each of the source-lines 110 isarranged to share for cells on one column with cells on an adjacentcolumn, a memory array can be arranged with cells on each column havingtheir own dedicated source-line. Furthermore, although the presentinvention is illustrated in a single cell and in a NOR array, it shouldbe apparent to those of ordinary skill in the art that a plurality ofcells of the present invention can be arranged in a rectangular array ofrows and columns, wherein the plurality of cells are constructed in AND,NAND array architectures well-known in the art or a combination of aNAND, AND, and a NOR array structure.

For memory cells in accordance with the present inventions, it should benoted that both program and erase operations can be done with absolutebias at a level less than or equal to 3.3V. Furthermore, the erasemechanism and cell architecture enable the individually erasable cellsfeature, which is ideal for storing data such as constants that requiredperiodically changed. The same feature is further extendable to smallgroup of such cells which are erased simultaneously (e.g. cells storinga digital word, which contains 8 cells). Additionally, the same featureis also further extendable to such cells which are erasablesimultaneously in large group (e.g. cells storing code for softwareprogram, which can contain 2048 cells configured in page, or contain aplurality of pages in block in array architecture).

Methods of Manufacturing

The present invention further provides self-alignment techniques andmanufacturing methods to form memory cells and memory array withillustration made on cell of the FIG. 8 type (cell 100) and on array ofthe FIG. 10 type. While illustration is made on cell 100, suchillustration is only by way of example and can be readily modified andapplied to other cells such as cell 200 in accordance with the presentinvention. As will be appreciated, reference indicators throughout thedrawings are shown only in a few places of identical regions in ordernot to overcomplicate the drawings.

Referring to FIG. 11 there is shown a top plan view of a semiconductorsubstrate 98 used as the starting material for forming memory cells andarray. A cross-sectional view along lines AA′ of FIG. 11 for thematerial thus described is shown in FIG. 11A, wherein the substrate 98is preferably a silicon of a first conductivity type (e.g. p-type). Abody 70 is formed in the substrate 98 by well-known techniques such asion implantation, and is assumed having the first conductivity type. Thebody 70 thus formed comprises same semiconductor material as that of thesubstrate 98. Alternatively, the body 70 can be formed by growing asemiconductor layer having at least a portion thereof different fromthat of the substrate by using conventional epitaxy technique. Forexample, body 70 can be a single crystal SiGe (“SiGe”) layer formed on asilicon substrate 98. Alternatively, using the epitaxy technique, body70 can be formed to comprise a lower portion of same material as thesemiconductor substrate 98 and an upper portion of a different materialas the semiconductor substrate 98. For example, the upper portion ofbody 70 can be a SiGe layer, and the lower portion of body 70 can besilicon formed on a silicon substrate 98. The body 70 can be optionallyisolated from the substrate 98 by a semiconductor region such as buriedwell 99 having a second type of conductivity (e.g. n-type). The buriedwell 99 can be formed by well-known techniques such as ion implantation.

With the structure shown in FIG. 11A, the structure is further processedas follows. A first insulator 132 is formed over the substrate 98 withthickness preferably at about 20 nm to about 50 nm. The insulator canbe, e.g., oxide deposited by employing conventional thermal oxidation,by HTO, by TEOS deposition processes using CVD techniques, or by in-situsteam generation (“ISSG”) growth techniques well-known in the art. Theinsulator 132 typically is in a single layer form. Next a layer ofdielectric 134 such as nitride is deposited over the structure using,for example, conventional LPCVD technique. The thickness of dielectric134 is preferably at about 10 nm to about 80 nm.

Next, a photo-resistant material (“photo-resist” hereinafter) on thestructure surface is suitably applied followed by a masking step usingconventional photo-lithography technique to selectively remove thephoto-resist leaving a plurality of photo-resist line traces oriented inthe second direction (column direction) over the dielectric 134. Theprocess is continued by etching the exposed dielectric 134 followed byetching the exposed first insulator 132 until the substrate 98 isobserved, which acts as an etch stop. Well-known etching techniques suchas Reactive-Ion-Etch (“RIE”) can be employed for this etching step. Theportions of dielectric 134 and first insulator 132 still underneath theremaining photo-resist are unaffected by this etch process. This stepforms a plurality of dielectric lines 134 a orientated in the seconddirection (or “column direction”). The structure is further processed byetching the exposed substrate 98 to form a plurality of first trenches136 each having sidewalls 137. The step also forms a plurality of firsttrench lines 136 a orientated in the second direction (or “columndirection”) with each pair of them spaced apart by one of the dielectriclines 134 a. The width of the dielectric lines 134 a and the distancebetween adjacent dielectric lines can be as small as the smallestlithographic feature of the process used. The remaining photo-resist isthen removed using conventional means. The top plan view of theresulting structure is shown in FIG. 12 and the cross-sectional viewsalong lines AA′ of the resulting structure is illustrated in FIG. 12A.

An ion implant step is then performed to dope the exposed substrateregion 98 with impurities of the second type of conductivity (n-type) toform diffusion regions 138 along sidewall 137 self-aligned to the firsttrench 136. FIG. 13 illustrates a cross-sectional view along lines AA′of FIG. 12 for such ion implant step. Typically, the ion implant isperformed by tilting ion beams 135 at a large angle 133 in either sideof a normal 139 of the substrate 98. Such diffusion regions 138 are usedto form the source 95 and drain 97 of memory cell, described inconnection with FIG. 8, and to form bit-lines 130 and source-lines 110of the memory array, described in connection with FIG. 10. The diffusionregions 138 are orientated in the second direction (or “columndirection”) with each pair of them spaced apart by the first trench 136.The width of the diffusion regions 138 and the distance between adjacentdiffusions 138 can be as small as the smallest lithographic feature ofthe process used. An optional ion implant step can be performed withcurrent beam aligned along the normal 139 to dope body 70 adjacent tobottom of trenches 136 with impurities of the first conductivity type(p-type). Proper thermal treatments such as Rapid-Thermal Annealing(RTA) technique are then applied to the structure to remove damagescaused by the ion implant and to redistribute the impurities indiffusion regions 138.

The process is continued by forming a second insulator layer 140 overthe exposed first trench 136 with thickness preferably at about 5 nm toabout 50 nm. The insulator 140 can be, for example, oxide formed byconventional thermal oxidation or by ISSG growth techniques, or can beHTO or TEOS deposited by conventional CVD techniques. The insulator canbe in single layer form or in composite layers form with other types ofinsulators such as nitride, oxynitride and FSG. The second insulator 140merges with the first insulator 132 at upper edges 137′ of the trenchsidewall 137.

The insulator 140 in various regions of trenches 136 can be formed tohave one thickness and one chemical composition or can be optionallyformed to have more than one thickness or more than one chemicalcomposition. FIG. 14 shows one example on the method for forminginsulator 140 having more than one thickness or more than one chemicalcomposition. The method includes forming a photo-resist 143 usingconventional photo-lithography technique over the structure toselectively cover insulator 140 on sidewalls such as 137 ₂ in oneportion of trenches 136 and expose insulator 140 on sidewalls such as137 ₁ in another portion of trenches 136. The method is continued byapplying an etching step, such as a wet etch of diluted HF acid, toremove the portion of insulator 140 in the exposed regions. Theunexposed portions of insulator 140 still underneath the remainingphoto-resist 143 are unaffected by this etch process. The structure isfurther processed by removing the photo-resist 143, followed by forminginsulator 140 in the exposed region using techniques such as CVD orthermal oxidation. The second insulator 140 thus formed includes aportion 140 ₁ in the exposed regions and a portion 140 ₂ in theunexposed region, wherein both portions 140 ₁ and 140 ₂ have differentthicknesses and/or chemical compositions. Typically, the portion 140 ₂of the insulator 140 in the exposed regions is thicker than the portion140 ₁ of insulator 140 in the unexposed region. The insulator 140 isused primarily for forming the RD 64 and SRD 64′ of the memory cells inaccordance with the present invention.

Next a layer of conductive material 66 a such as polysilicon isdeposited over the structure using, for example, conventional LPCVDtechnique with polysilicon film doped in-situ or by a subsequent ionimplant. The conductive material 66 a is for forming CSR 66 of memorycells. Typically, the conductive material 66 a is with a thickness thickenough to fill the first trenches 136 and can be on the order of, forexample, about 20 nm to 200 nm. Preferably, the topography of theconductive material 66 a thus formed is substantially planar, and anoptional planarization process such as chemical-mechanical polishing(“CMP”) can be used for achieving the planar topography. It should benoted that polysilicon is chosen for material 66 a for illustrationpurpose (due to process simplicity). In general, any other conductivematerials that have a good trench-gap filling capability and stablematerial property at high temperature (e.g. 900° C.) can be employedinstead. The cross-sectional views along lines AA′ of FIG. 12 for theresulting structure is illustrated in FIG. 15.

Next, a planarization step follows (preferably CMP) to etch theconductive material 66 a down to the dielectric 134, leaving blocks ofthe conductive material 66 a in first trenches 136. An etch-back stepfollows to recess the top portion of blocks of conductive material 66 abelow the tops of the dielectric 134. An oxide layer 93 a is then formedon top of each of blocks of the conductive material 66 a by employingconventional thermal oxidation, HTO, TEOS or ISSG deposition techniquesor a combination thereof. For example, assuming polysilicon be theconductive material 66 a, oxide layer 93 a can be formed by oxidizingthe top portion of the polysilicon followed by depositing a HTO layerthere over. The oxide layer 93 a can have a thickness in the range ofabout 5 nm to about 20 nm. The process is continued by forming acoupling dielectric 142, such as nitride, with thickness preferably inthe range of about 3 nm to about 15 nm over the oxide layer 93 a. Thedielectric 142 of nitride can be deposited by LPCVD technique well-knownin the art. Typically, any other types of dielectrics (e.g. Al₂O₃, HfO₂etc.) having dielectric constant higher than that of oxide and havingmaterial properties compatible to semiconductor manufacturing can beconsidered for the coupling dielectric 142.

Next, a photo-resist on the structure surface is suitably appliedfollowed by a masking step using conventional photo-lithographytechnique to selectively remove the photo-resist leaving a plurality ofphoto-resist line traces 143 oriented in the second direction (columndirection) over the dielectric 142. The process is continued by etchingthe exposed dielectric 142 followed by etching the exposed oxide layer93 a until the insulator 134 and the block of conductive material 66 athat are uncovered by the photo-resist 143 are observed, which act asetch stops. The portions of layers 142 and 93 a still underneath theremaining photo-resist 143 are unaffected by this etch process. Anetching step follows to etch the exposed conductive material 66 a in thefirst trench 136 until the second insulator 140 is observed, which actsas an etch stop. This step removes the exposed conductive material 66 ain the first trench 136 to form a plurality of WL trenches 144 orientedin the second direction (column direction) with each of them interlacedwith a photo-resist line trace 143. An optional ion implantation can beperformed to dope the portion of body 70 adjacent to a bottom 144 b ofthe WL trench 144 with impurities of the first conductivity type. Thisstep forms a field-stopper (not shown) self-aligned to the WL trench 144to prevent diffusions 138 on either side of WL trench 144 from shortingeach other. The cross-sectional views along lines AA′ of FIG. 12 for theresulting structure is illustrated in FIG. 16.

The process is continued by removing the remained photo-resist linetraces 143. Next, a layer of oxide is formed over the structure to fillthe WL trenches 144. Typically, the layer of oxide is with a thicknessthick enough to fill the WL trenches 144 and can be on the order of, forexample, about 20 nm to 300 nm. Preferably, the topography of the oxidelayer thus formed is substantially planar. The step is followed by aplanarization process (e.g. CMP) and an etch-back process (e.g. RIE) torecess the top portion of the oxide layer to a level below the tops ofthe WL trench 144. Dielectric 142 and the exposed portion of dielectric134 act as etching mask for the etch-back process. This step forms blockof field oxide (“FOX”) 90 in a lower portion of and self-aligned to theWL trench 144. The FOX 90 provides the effect on preventing diffusions138 on either side of WL trench 144 from shorting each other duringmemory operations. The second insulator 140 on sidewalls 145 of the WLtrench 144 is removed during the same step. An optional wet etch (e.g.diluted HF acid for second insulator 140 of oxide) is then followed toremove any residues for a thorough cleaning of the second insulator 140.The cross-sectional views along lines AA′ of FIG. 12 for the resultingstructure is illustrated in FIG. 17.

Next, a filter 52 is formed over the structure. In a specificembodiment, a third insulator 54 a and a fourth insulator 53 a areconsidered for the filter 52. The third insulator layer 54 a such asnitride is formed over the structure by employing thermal nitridationsuch as rapid-thermal-nitridation (RTN) in NH3 ambient at 1050 C. Thethird insulator 54 a has a thickness preferably at about 2 nm to about 6nm. In region external to the WL trench 144, the third insulator 54 a ismerged with the coupling dielectric 142 as one layer. The process iscontinued by forming the fourth insulator layer 53 a such as oxide overthe third insulator 54 a. The fourth insulator can be formed by usingthermal oxidation, HTO, TEOS, or ISSG techniques well-known in the art.HTO, which is typically formed with chemistry containing dichlorosilane(SiCl₂H₂) and nitrous oxide (N₂O), has a good film quality and a goodconformity to structure topography and hence is a more preferablematerial for the fourth insulator 53 a. The fourth insulator 53 a has athickness preferably in the range of about 2 nm to about 4 nm. Both thethird and fourth insulator layers 54 a and 53 a are also formed insidethe WL trench 144 including over the sidewalls 145. The third and fourthinsulator layers 54 a and 53 a are used as BD 54 and TD 53,respectively, of the memory cells in accordance with the presentinvention. The cross-sectional views along lines AA′ of FIG. 12 for theresulting structure is illustrated in FIG. 18.

The process is continued by forming a layer of conductive material 92 asuch as polysilicon over the structure using, for example, conventionalLPCVD technique with polysilicon film doped in-situ or by a subsequention implantation. The conductive material 92 a is for forming word-lines92 of memory cells and array. The portion of WL 92 over the WL trench144 fills the WL trench 144 to form TG 61 of memory cells. Typically,the conductive material 92 a is with a thickness thick enough to fillthe WL trenches 144 and can be on the order of, for example, about 50 nmto 500 nm. Preferably, the topography of the conductive material 92 athus formed is substantially planar, and an optional planarizationprocess (i.e. CMP) can be used for achieving the planar topography. Itshould be noted that polysilicon is chosen for material 92 a forillustration purpose (due to process simplicity). In general, any otherconductive materials that have a low sheet resistance, a good trench-gapfilling capability, and stable material property at high temperature(e.g. 900° C.) can be employed instead. For example, a metalizedpolysilicon layer such as polysilicon with tungsten-polycide atop can beemployed for the conductive layer 92 a by using well-known CVDtechnique. Tungsten-polycide has a sheet-resistance typically about 1 to10 Ohms/square, and is significantly lower than that in an un-metalizedheavily doped polysilicon, whose sheet-resistance is typically about 100to 300 Ohms/square. Other conductors that are readily available insemiconductor manufacturing, such as platinum-silicide, nickel-silicide,cobalt-silicide, titanium-silicide, TiN, TaN etc., can also beconsidered as conductive layer 92 a. Further, such types of conductorscan be formed atop of polysilicon to form a composite conductor for useas layer 92 a.

The process is continued by forming a layer of dielectric 146 such asnitride over the structure using, for example, conventional LPCVDtechnique. The thickness of dielectric 146 is preferably at about 10 nmto about 80 nm. The cross-sectional views along lines AA′ of FIG. 12 forthe resulting structure is illustrated in FIG. 19.

Next, a photo-resist on the structure surface is suitably appliedfollowed by a masking step using conventional photo-lithographytechnique to selectively remove the photo-resist leaving a plurality ofphoto-resist line traces oriented in the first direction (row direction)over the dielectric layer 146.

The process is continued by etching the exposed dielectric layer 146followed by etching the exposed conductive material 92 a until thefourth insulator 53 a is observed, which acts as an etch stop. This stepalso exposes the portion of conductive material 92 a in the WL trench144. The portions of layer 92 a underneath the remaining photo-resistare unaffected by this etch process. A sequence of etching steps is thenperformed to remove the fourth insulator 53 a, the third insulator 54 a,the dielectric 142 and the oxide layer 93 a in regions uncovered by thephoto-resist until conductive material 66 a in the first trenches 136 isobserved, which acts as an etch stop. The structure is further processedby applying an etching step to remove the exposed conductive materials92 a and 66 a until the second insulator 140 in first trench 136 and thefourth insulator 53 a in WL trench 144 are observed. This step forms aplurality of CSR 66 arranged in rows and columns. Additionally, thisstep forms a plurality of word lines 92 orientated in the firstdirection (or “row direction”) with each pair of them spaced apart by asecond trench 148. The width of the word-lines 92 and the distancebetween adjacent word-lines can be as small as the smallest lithographicfeature of the process used.

The remaining photo-resist is then removed using conventional means. Thetop plan view of the resulting structure is shown in FIG. 20 withword-lines 92 interlaced with the second trenches 148. Also shown arethe array of CSR 66 and the diffusions 138 described in connection withFIG. 13. The cross-sectional views along lines AA′, BB′, CC′, DD′ andEE′ of the resulting structure are collectively illustrated in FIGS.20A, 20B, 20C, 20D and 20E, respectively.

The process is continued by optionally forming a sidewall insulatinglayer 150 such as oxide on sidewalls of word-lines 92, including TG 61,and on sidewalls of CSR 66 exposed to the second trench 148. The oxidecan be formed by, for example, performing a thermal oxidation step usingrapid-thermal-oxidation (RTO) technique, and can have a thickness atabout 2 nm to about 8 nm. Next, a relative thick dielectric layer (e.g.oxide) is formed to fill the second trenches 148 by using well-knowntechniques such as conventional CVD techniques. The oxide dielectric iswith a thickness, for example, in the range from about 20 nm to 500 nm.The oxide dielectric is then selectively removed to leave oxide blocks152 in region within the trenches 148. The preferable structure is withthe top surface of the oxide blocks 152 substantially co-planar with thetop surface of the nitride dielectric 146. This can be done by, forexample, employing a chemical-mechanical polishing (CMP) process toplanarize the thick oxide followed by an RIE (reactive ion etch) usingnitride dielectric 146 as a polishing and/or etching stopper. Anoptional oxide over-etching step follows if necessary to clear any oxideresidue on the nitride dielectric 146. Thereby, the process leaves oxideonly in trenches 148 to form oxide blocks 152 self-aligned to the secondtrenches 148. The top plan view of the resulting structure isillustrated in FIG. 21 with word-lines 92 interlaced with the oxideblocks 152. The cross-sectional views along lines AA′, BB′, CC′, DD′,and EE′ of the resulting structure are collectively illustrated in FIGS.21A, 21B, 21C, 21D and 21E.

The resulting structure of FIG. 21 comprises various components for thearray of FIG. 10 type. Referring to FIG. 21, there are shown a pluralityof memory cells, including cells 100 ₂, 100 ₃, 100 ₄ and 100 ₆, arrangedin rows and columns, a plurality of word-lines 92, including word-lines92 ₁, 92 ₂, and 92 ₃, and a plurality of diffusions 138, includingbit-lines 130 ₂, 130 ₃ and 130 ₄, and source-lines 110 ₁ and 110 ₃. FIG.21A also shows various regions of a memory cell such as cell 100 ₃ ofthe FIG. 8 type (cell 100). The bit-line 130 ₃ and the source-line 110 ₃also represent the drain 97 and source 95 they respectively connectedto. Further, there are shown CD 68, CSR 66, conductor-insulator system60 including drain 97 and RD 64, filter 52 including BD 54 and TD 53,and WL 92 including TG 61. All these regions are identical to theirrespective regions in cell 100 described in connections with FIG. 8.

The structure of FIG. 21 is completed by employing conventionalpassivation and metallization processes well-known in the arts. Theseprocesses include forming a passivation layer, such as BPSG, and formingcontacts and metal lines over the structure to make electricalconnections to various regions of cells and array, including word-lines92, bit-lines and source-lines 130 and 110, body 70, buried well 99, andsubstrate 98.

Although the manufacturing methods are shown with process steps incurrent order, it should be clear to those of ordinary skill in the arthaving the benefit of this disclosure that not all process steps need beperformed in the exact order, but rather in any order that properly formthe memory cells and array of the present invention. Further, CSR of thepresent invention need not be in rectangular shape in their top view,need not be in rectangular in their cross-sections, but rather can beany size and shape in their top view and in their cross-sections thateffectively store charges and effectively connects the drain and sourcein each memory cell. Additionally, the top and the bottom surface offilter need not be parallel, need not be flat, need not be co-planarwith the substrate surface, but rather can be at any level under orabove the substrate surface, in any angle with the substrate surface,and with other shape that can effectively perform the filteringfunctions.

1. A method of providing a memory cell comprising: providing a body of asemiconductor material having a first conductivity type; arranging afilter of a conductor-filter system in contact with a first conductor ofthe conductor-filter system; arranging at least portion of a secondconductor of a conductor-insulator system in contact with the filter;arranging a first insulator of the conductor-insulator system in contactwith the second conductor at an interface; arranging a first regionspaced from the second conductor; arranging a channel of the bodybetween the first region and the second conductor; arranging a secondinsulator adjacent to the first region; arranging a charge storageregion between the first and the second insulators; arranging a firstportion of a word-line adjacent to and insulated from the charge storageregion; and arranging a second portion of the word-line adjacent to andinsulated from the body.
 2. The method of claim 1 further comprisingcontrolling flow of charge carriers of one polarity through the filterin one direction using a first set of electrically alterable potentialbarriers of the filter.
 3. The method of claim 2 further comprisingcontrolling flow of charge carriers of an opposite polarity through thefilter in another direction that is substantially opposite to the onedirection using a second set of electrically alterable potentialbarriers.
 4. The method of claim 2 further comprising receivingenergized charge carriers in the second conductor from the filter. 5.The method of claim 4 further comprising providing electricallyalterable Image-Force potential barriers adjacent to the interface usingthe first insulator.
 6. The method of claim 1 further comprising:arranging a first dielectric of the filter adjacent to the firstconductor; and arranging a second dielectric of the filter adjacent tothe first dielectric, wherein at least one of: the second dielectric hasa dielectric constant that is substantially greater than a dielectricconstant of the first dielectric; and the first dielectric has a firstdielectric constant and a first thickness and the second dielectric hasa second dielectric constant and a second thickness, and wherein aproduct of the second dielectric constant and the first thickness issubstantially greater than a product of the first dielectric constantand the second thickness.
 7. The method of claim 1 further comprising:arranging a first dielectric of the filter adjacent to the firstconductor and having an energy band gap; and arranging a seconddielectric adjacent to the first dielectric, wherein the seconddielectric has an energy band gap narrower than the energy band gap ofthe first dielectric.
 8. The method of claim 7 wherein the firstdielectric comprises oxide, and the second dielectric comprises materialselected from the group consisting of nitride, oxynitride, Al₂O₃, HfO₂,TiO₂, ZrO₂, Ta₂O₅, and alloys formed thereof.
 9. The memory cell ofclaim 7 wherein the first dielectric comprises oxynitride and the seconddielectric comprises material selected from the group consisting ofnitride, Al₂O₃, HfO₂, TiO₂, ZrO₂, Ta₂O₅, and alloys formed thereof. 10.The method of claim 1 further comprising selecting a work function ofthe charge storage region to be greater than a work-function of thesecond conductor.
 11. The method of claim 1 wherein the charge storageregion comprises p-type polysilicon and the second conductor comprisesn-type silicon.
 12. The method of claim 1 wherein the first region andthe second conductor comprise a semiconductor material having a secondconductivity type.
 13. The method of claim 1 wherein the body comprisessilicon, and wherein the first region and the second conductor comprisesa semiconductor material selected from the group consisting of siliconand SiGe.
 14. The method of claim 1 wherein the first region comprises afirst connector and a first junction and the second conductor comprisesa second connector and a second junction.
 15. The method of claim 14further comprising self-aligning at least one of the first connector andthe first junction and the second connector and the second junction. 16.The method of claim 14 further comprising selecting at least one of thefirst and second junctions from the group consisting of p-n junction andSchottky junction.
 17. The method of claim 14 wherein at least one ofthe first and second connectors comprises a material selected from thegroup consisting of polysilicon, poly-SiGe, SiGe, Al, Pt, Au, W, Mo, Ru,Ta, Ni, TaN, TiN, platinum-silicide, titanium silicide,tungsten-silicide, tungsten-polycide, nickel-silicide, cobalt-silicide,erbium silicide, terbium silicide, dysprosium silicide, and ytterbiumsilicide.
 18. The method of claim 1 wherein the word-line comprises amaterial selected from the group consisting of n+ polysilicon, p+polysilicon, poly-SiGe, Al, Pt, Au, W, Mo, Ru, Ta, Ni, TaN, TiN, andalloy formed thereof.
 19. The method of claim 1 further comprisingarranging a buried well of a semiconductor material having a secondconductivity type between the body and a substrate.
 20. The method ofclaim 1 wherein the first and the second insulators comprise dielectricsof an oxynitride system SiO_(x)N_(1-x).
 21. The method of claim 5further comprising transporting the energized charge carriers over theImage-Force potential barrier onto the charge storage region.
 22. Themethod of claim 21 wherein the transporting comprises at least one of:using ballistic-hole injection, wherein the energized charge carrierscomprise ballistic light-holes; and using ballistic-electron injection,wherein the energized charge carriers comprise ballistic electrons. 23.The method of claim 1 further comprising: providing a plurality of thememory cells; arranging the plurality of memory cells in a rectangulararray of rows and columns; arranging a plurality of the word-linesoriented in a first direction; arranging a plurality of source-linesoriented in a second direction; and arranging a plurality of bit-linesoriented in the second direction, wherein each of the word-linesconnects a third conductor of each of the memory cells in a same row,each of the bit-lines connects the second conductor of each of thememory cells in a same column, and each of the source-lines connects thefirst region of each of the memory cells in a same column.
 24. Thenonvolatile memory array of claim 1 further comprising: providing aplurality of the memory cells; arranging the memory cells as pairs ofmemory cells; and sharing a single first region between each of thememory cell pairs.
 25. The nonvolatile memory array of claim 1 furthercomprising: providing a plurality of the memory cells; and arranging thememory cells as pairs of memory cells, wherein one cell of one cell pairin one column and one cell of another cell pair in a same row and in anadjacent column shares a single first conductor therebetween.